| Allicdata Part #: | ATS-11E-81-C1-R0-ND |
| Manufacturer Part#: |
ATS-11E-81-C1-R0 |
| Price: | $ 3.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11E-81-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.03156 |
| 30 +: | $ 2.94945 |
| 50 +: | $ 2.78573 |
| 100 +: | $ 2.62181 |
| 250 +: | $ 2.45796 |
| 500 +: | $ 2.37602 |
| 1000 +: | $ 2.13022 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks are used in various industries for a variety of purposes. ATS-11E-81-C1-R0 is a specific type of thermal heat sink that is designed to dissipate heat quickly and efficiently and is widely used in today’s technology.
Though this particular heat sink is traditionally used for cooling electronics, it can be used in many other applications – from medical equipment to automotive parts. The ATS-11E-81-C1-R0 provides a number of benefits thanks to its design, which includes an aluminum base and a finned extrusion of thermal material.
At the heart of the ATS-11E-81-C1-R0 is its main feature – the heat conduction fin. This fin is composed of a thin layer of aluminum, sandwiched between two layers of thermal material. This fin is a highly efficient conductor of heat, meaning it quickly dissipates heat from a device, preventing the device from becoming over-heated. In addition, the aluminum layers serve to block out any stray electromagnetic interference (EMI) from the device.
The fin has a number of benefits that make it suited for this application. Firstly, it has great thermal dispersion qualities – allowing it to spread heat evenly and quickly. Also, the fin is able to absorb more heat than other heat sinks because of its construction – the thermal material is able to absorb heat and the aluminum base serves as a heat sink, pulling heat away from the device.
Additionally, the ATS-11E-81-C1-R0 is able to maintain optimal temperatures thanks to its construction. The thermal material acts as an insulator, preventing heat from escaping from the device and trapping it in the heat conduction fin. As a result, maximum temperatures can be reached quickly and efficiently.
Finally, the ATS-11E-81-C1-R0 is designed to be durable and reliable. The aluminum base is designed to resist corrosion and wear, while the fin is designed to evenly dissipate heat without any build-up. This ensures that the heat sink is able to perform its duties for many years to come.
The ATS-11E-81-C1-R0 is an excellent example of a thermal heat sink. It is designed to absorb and dissipate heat quickly and efficiently, and is suitable for a variety of applications. Its construction ensures maximum heat dissipation and long-term reliability.
The specific data is subject to PDF, and the above content is for reference