| Allicdata Part #: | ATS-11E-97-C1-R0-ND |
| Manufacturer Part#: |
ATS-11E-97-C1-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11E-97-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-11E-97-C1-R0 is a type of thermal-heat sink technology developed for the application of high-efficiency, low-power thermal cooling systems. Heat sinks are devices that dissipate large amounts of heat by using an airflow to absorb and move it away from the point of application. Heat sinks are commonly used in applications such as electronics, computers, and industrial machinery, but their application fields are expanding rapidly.
The ATS-11E-97-C1-R0 is specifically designed to meet the needs of modern, high-performance applications, such as graphics cards. It is capable of dissipating heat at a rate of up to 5.5W/50mm2. This makes it suitable for a wide range of applications, from industrial machinery to embedded computers. The design of the ATS-11E-97-C1-R0 also allows for a high level of customization, allowing it to be tailored to the specific requirements of the application.
The ATS-11E-97-C1-R0 utilizes a combination of heat pipe and liquid cooling to move heat away from the application. Heat pipes are a type of thermal interface material that uses a combination of the evaporation and condensation of a liquid to transfer heat. This type of heat transfer is highly efficient, as it can move a large amount of heat from one area to another. This type of cooling is used for many applications, including computers, embedded systems, and industrial machinery.
The ATS-11E-97-C1-R0 also incorporates a liquid cooling system that moves heat away from the application. The liquid cooling system consists of a pump, a heat exchanger, and a reservoir. The pump circulates liquid through the heat exchanger, extracting heat. The reservoir then transfers the heat to an external cooling system. This type of cooling system is highly efficient and is capable of dissipating large amounts of heat quickly and efficiently.
The ATS-11E-97-C1-R0 is a highly efficient, low-power thermal cooling system. Its combination of heat pipe and liquid cooling makes it suitable for a wide range of applications, from embedded devices to graphic cards. Its ability to dissipate large amounts of heat quickly and efficiently makes it suitable for a variety of applications. As such, the ATS-11E-97-C1-R0 is a great choice for those looking for a reliable thermal solution for their application.
The specific data is subject to PDF, and the above content is for reference