| Allicdata Part #: | ATS19468-ND |
| Manufacturer Part#: |
ATS-11E-97-C2-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11E-97-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.93750 |
| 10 +: | $ 3.82851 |
| 25 +: | $ 3.61595 |
| 50 +: | $ 3.40326 |
| 100 +: | $ 3.19051 |
| 250 +: | $ 2.97781 |
| 500 +: | $ 2.76511 |
| 1000 +: | $ 2.71193 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are indispensable components in electronic systems. In the current market, ATS-11E-97-C2-R0 is one of the popular thermal heat sinks used in many applications. This article aims to discuss the application field and working principle of the device.
The ATS-11E-97-C2-R0 thermal heat sink is a popular choice for a variety of electronic applications. Because of its high efficiency rate and low air resistance, it is suitable for use in high-heat and high-efficiency power electronics, such as in power supplies, LEDs, storage devices, and power converters. It also works well in cooling and conserving heat in motor controllers, drivers, and solar inverters, which use both electrical and thermal power.
The ATS-11E-97-C2-R0 thermal heat sink is made with extruded aluminum and is designed to reduce air resistance while distributing heat evenly. The heat sink consists of a base plate and a series of fins, which are connected to a heat pipe that transfers the heat away from the fins. As air passes through the fins, it absorbs heat and cools the fins, eventually releasing the heat energy. This efficient transfer of heat is essential to the functioning of the device.
The ATS-11E-97-C2-R0 is also designed with an optimized internal structure that increases its heat dissipation efficiency and offers high reliability in the long run. The fin design is optimized to provide a thin, uniform heat dissipation surface, while the bottom pads are built to ensure uniform contact with the components. This ensures that the heat is evenly distributed throughout the thermal heat sink, resulting in optimal heat dissipation.
In addition to its heat dissipation capabilities, the ATS-11E-97-C2-R0 also offers excellent electromagnetic interference (EMI) suppression. The thermal design and the use of robust shielding materials make it resistant to interference caused by external sources. This makes it an ideal choice for applications in the medical, aerospace, and automotive industries.
The ATS-11E-97-C2-R0 is easy to install and use in nearly any application. Installation requires minimal hardware, and the device can be quickly and easily mounted to a board or surface. It is also lightweight and features a pre-applied thermal adhesive for secure and reliable installation.
Overall, the ATS-11E-97-C2-R0 thermal heat sink is an efficient and reliable solution for many applications. With its low air resistance and high heat dissipation efficiency, it is ideal for high-efficiency power electronics, and its EMI suppression capabilities make it suitable for medical, aerospace, and automotive uses. The device\'s lightweight design and easy installation make it an attractive option for electronics engineers.
The specific data is subject to PDF, and the above content is for reference