| Allicdata Part #: | ATS-11F-02-C3-R0-ND |
| Manufacturer Part#: |
ATS-11F-02-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-02-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are incredibly important components when it comes to maintaining optimal function for electronic components and assemblies. This is particularly true for applications involving high power, as heat buildup can cause the electronic components and assemblies to suffer reduced performance or even fail entirely. The ATS-11F-02-C3-R0 thermal heat sink is designed for applications needing exacting thermal management solutions and is an excellent solution for managing the temperature of high power devices.
The ATS-11F-02-C3-R0 thermal heat sink is solidly constructed of aluminum alloy and features a simple, yet elegant design. It features a total of 240 cooling fins that provide a large surface area for the heat to dissipate. The aluminum alloy construction also saves weight, making this heat sink perfect for applications where weight is critical. The overall dimensions of the ATS-11F-02-C3-R0 are 5.75 inches by 5.75 inches by 2.75 inches and it weighs in at just 7 ounces.
The ATS-11F-02-C3-R0 thermal heat sink is an ideal solution for a number of applications, including LED lighting, television and projector displays, telecommunications electronics, automotive electronics, and medical electronics. It is well suited for managing the thermal profiles of devices that generate a moderate to high amount of power, such as those used in high-definition displays, cameras, video projectors, power amplifiers, wireless infrastructure, and power converters.
The ATS-11F-02-C3-R0 thermal heat sink works on the principle of natural convection, which is the process of transferring heat from one place to another using air currents. The thermal heat sink utilizes the principle of natural convection to capture the heat generated by electronic components and assemblies and transfer it to the cooling fins. The fins then disperse the heat into the air around the device, allowing it to cool faster. The result is more efficient thermal management and less heat buildup.
Overall, the ATS-11F-02-C3-R0 thermal heat sink is an excellent solution for thermal management applications that require high power components. Its aluminum alloy construction ensures durability and long life, while its modest weight makes it ideal for applications where weight is a critical factor. The addition of 240 cooling fins helps dissipate heat quickly and efficiently. Thanks to the principles of natural convection, the ATS-11F-02-C3-R0 thermal heat sink helps to keep high power electronic components and assemblies running at optimal temperatures, so that their performance is not compromised.
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