| Allicdata Part #: | ATS-11F-08-C3-R0-ND |
| Manufacturer Part#: |
ATS-11F-08-C3-R0 |
| Price: | $ 3.78 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-08-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.43539 |
| 30 +: | $ 3.34278 |
| 50 +: | $ 3.15706 |
| 100 +: | $ 2.97140 |
| 250 +: | $ 2.78568 |
| 500 +: | $ 2.69282 |
| 1000 +: | $ 2.41425 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.71°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an increasingly important aspect of system design, due to the ever-growing demands of applications driven by advanced technologies such as artificial intelligence, virtual reality, and cloud computing. Heat sinks are essential components in effective thermal management of electronic devices, as they help dissipate heat away from critical components while maintaining a safe operating temperature. The ATS-11F-08-C3-R0 is a heat sink manufactured by Advanced Thermal Solutions, Inc. (ATS) that is designed to meet the specific thermal requirements of a wide range of electronic applications.
The ATS-11F-08-C3-R0 is a two-piece aluminum heat sink with an integrally formed clip for attaching it to a printed circuit board (PCB). It was designed to provide maximum thermal performance in a small form factor and operates in contact with an underlying board for immediate heat transfer. Its 0.75 mm-thick aluminum fins have a unique fin geometry and are designed to ensure rigorous cooling performance. The fins are grooved, allowing for an efficient air flow to dissipate the heat away from the heat source quickly and evenly. The ATS-11F-08-C3-R0 utilizes a combination of both convection and conduction to cool components down to an optimal level.
The ATS-11F-08-C3-R0 was designed with safety in mind and its materials are flame retardant, making it compliant with UL 746C requirements for flammability characterizations of plastic and electronic components. This helps to ensure that it poses no risk of fire when used in electronic applications, making it suitable for operation in hazardous environments. Additionally, the heat sink is protected by an electrostatic discharge (ESD) safe material, eliminating any potential damage from electric current or static electricity.
The ATS-11F-08-C3-R0 is ideal for use in applications where size and performance are of utmost importance. Its low profile design and robust thermal performance make it suitable for use in a wide range of electronic devices, such as mobile phones, computers, and gaming consoles. Its ability to efficiently dissipate heat away from the heat source, accompanied by its UL 746C compliance and ESD safe material, make it ideal for use in applications where safety is a priority, such as medical equipment and industrial robotics. The heat sink can also be used in automotive systems, as it is able to withstand high temperatures and the vibrations associated with extreme temperature environments.
In conclusion, the ATS-11F-08-C3-R0 is a high-performance, two-piece aluminum heat sink that is designed to provide maximum thermal performance in a small form factor. Its unique fin geometry, UL 746C compliance, and ESD safe construction make it suitable for a wide range of electronic applications, such as mobile phones, computers, gaming consoles, medical equipment, industrial robotics, and automotive systems. Its robust thermal performance and ability to efficiently dissipate heat away from the heat source make it an ideal choice for thermal management in today’s highly demanding modern applications.
The specific data is subject to PDF, and the above content is for reference