| Allicdata Part #: | ATS-11F-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-11F-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are a type of passive heat transfer component used to cool electrical components. An ATS-11F-10-C1-R0 is a specifically designed thermal-heat sink which is used to cool high power transistors and other components that generate a lot of heat due to their high current and voltage ratings. The ATS-11F-10-C1-R0 is an incredibly efficient heat dissipation component that is used in many industrial applications.
The ATS-11F-10-C1-R0 is specifically designed to provide an efficient and affordable solution to high power cooling. It features a dual fin design that provides increased surface area and thus allows for better cooling performance. The ATS-11F-10-C1-R0 has a fin count of up to 10 fins per inch and offers a thermal resistance as low as 0.7 °C/W. The heat sink utilizes advanced thermal technology to provide superior cooling performance and is constructed from aluminum alloy which is highly conductive and offers excellent corrosion resistance.
The ATS-11F-10-C1-R0 utilizes a unique copper-filling technology to further improve its heat dissipation abilities. The copper filling allows for increased thermal conductivity and thus better cooling performance. The copper also enhances the thermal stability and reduces the temperature gradient of the thermal-heat sink by reducing thermal stress. The copper-filling technology also provides the additional benefit of making the thermal-heat sink more robust which is especially advantageous in harsh industrial environments.
The ATS-11F-10-C1-R0 thermal-heat sink is also designed to provide superior level of air flow and ventilation. It is designed to provide natural convection of air and prevent dust and debris from accumulating inside the thermal-heat sink. This reduces the risk of component failure due to overheating and also allows for better air flow inside the heat sink, thus reducing the fan noise level.
The ATS-11F-10-C1-R0 thermal-heat sink can be used in a number of applications. It is often used to dissipate heat from power supplies, voltage regulators, power modules, transistors and LED lighting. It is also suitable for use in automotive, process automation and industrial applications. Additionally, it can be used for cooling high power laser diodes and other heat sources.
In conclusion, the ATS-11F-10-C1-R0 thermal-heat sink is an efficient and reliable cooling solution for a variety of industrial applications. It offers superior thermal performance, high resistance to corrosion and better air flow for improved cooling performance. The copper-filling technology also provides an additional thermal layer and enhances the heat-sink\'s robustness, making it an ideal solution for harsh industrial environments.
The specific data is subject to PDF, and the above content is for reference