| Allicdata Part #: | ATS-11F-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-11F-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management has become increasingly important over the past few decades. As electronic devices such as chips become faster and more powerful, they generate and release more and more heat. To ensure proper operation and prevent overheating, it is necessary to efficiently dissipate heat away from the device. Heat sinks are essential components of thermal management systems, and the ATS-11F-10-C3-R0 is an example of one such type of heat sink.
ATS-11F-10-C3-R0 is a light aluminum-fin heat sink designed to dissipate heat quickly, efficiently, and quietly. It is designed to meet the stringent requirements of the electronic device it is cooling. This heat sink is suitable for use in a wide variety of applications, including server cooling, automotive, industrial automation, as well as in electronic and medical equipment. It is also well-suited to applications involving radio frequency (RF) signals.
The ATS-11F-10-C3-R0 heat sink is constructed of an aluminum finned base with three extruded aluminum fins that are bonded to the base plate. The aluminum finned base acts as a heat exchanger, transferring thermal energy that is generated by the electronic components to the aluminum fins. As the thermal energy passes through the fins, it is dissipated into the surrounding air. The extruded fins help to increase the overall surface area of the heat sink and therefore improve its cooling efficiency.
The ATS-11F-10-C3-R0 features a forward-looking design with low air resistance. This allows for more efficient cooling performance and quieter operation. Additionally, the heat sink features a static pressure of 2.55 mmH2O, a noise signal of 17 dB, and airflow of 31.4CFM. This makes it a suitable choice for environments where noise levels must be kept low. The heat sink is also lightweight and has a small footprint, making it easy to install in tight spaces.
The ATS-11F-10-C3-R0 also provides excellent heat distribution, thanks to its efficient fin design. The base plate provides a maximum surface area which helps to disperse the heat evenly and maintain optimal thermal performance. Additionally, the aluminum fins help to spread thermal energy more quickly and efficiently than other types of thermal management systems.
In conclusion, the ATS-11F-10-C3-R0 is a versatile and reliable heat sink that is perfect for applications where noise levels must be kept low. It features a lightweight design and has an efficient fin design which helps to evenly distribute thermal energy and ensure optimal performance. Additionally, the heat sink provides excellent airflow and static pressure, making it an ideal choice for many types of electronic devices. This thermal - heat sink is thus well suited to many applications where reliable thermal management is needed.
The specific data is subject to PDF, and the above content is for reference