| Allicdata Part #: | ATS-11F-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-11F-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat sinks are an important part of any mechanical system. They help to dissipate, or transfer, heat away from sensitive components. As a result, cooling and regulating temperatures becomes much simpler and reliable. The ATS-11F-117-C1-R0 heat sink is a powerful, reliable heat dissipating component for any system.
The ATS-11F-117-C1-R0 is a aluminum extruded finned heat sink. It is designed to provide the optimum amount of cooling for components with excess amounts of heat. Composed primarily of high-quality aluminum, the ATS-11F-117-C1-R0 is available in a number of sizes and styles. The design of the finned aluminum helps the sink dissipate heat much more quickly than a standard heat sink.
The ATS-11F-117-C1-R0 excels in a variety of applications. In communication systems, such as cell phones, laptops, and telecommunications, the heat sink helps to reduce power consumption and keep them operating at an optimal temperature. It can also be used to protect and cool server and data storage systems, military and aerospace components, microprocessors, digital signal processors, and many other types of sensitive electronic hardware.
In order to effectively remove the heat generated by your system, the ATS-11F-117-C1-R0 uses a combination of convection and conduction of heat. Convection is the process of heat being transferred by a liquid or gas, while conduction is the physical transfer of heat through the molecular vibration of solids. Combining these two heat transfer methods allows the heat sink to efficiently transfer heat away from the components.
To make sure your heat sink is working effectively, there are a few things that need to be taken into account. First off, the heat sink must be mounted securely to a flat surface. Improvements can also be made by using a higher-grade aluminum and applying a readon fins or similar cooling material to the fan. Additionally, the cooling fan should be placed on the correct side of the sink with the coldest air blowing in the same direction as the heat sink’s fins. Following these steps will ensure the ATS-11F-117-C1-R0 is providing the best cooling possible.
Overall, the ATS-11F-117-C1-R0 is an excellent choice for systems requiring active cooling. The combination of its extruded aluminum fins and the ability to accept a variety of cooling fans makes it one of the most efficient and reliable thermal-heat sinks available. Its ability to reduce power consumption, keep system temperatures in check, and its resistance to corrosion, make it a valuable asset to any system.
The specific data is subject to PDF, and the above content is for reference