| Allicdata Part #: | ATS-11F-122-C3-R0-ND |
| Manufacturer Part#: |
ATS-11F-122-C3-R0 |
| Price: | $ 3.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-122-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.49524 |
| 30 +: | $ 3.40074 |
| 50 +: | $ 3.21174 |
| 100 +: | $ 3.02280 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.73940 |
| 1000 +: | $ 2.45602 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-11F-122-C3-R0 thermal - heat sink is an efficient and effective device used in many industrial applications. Designed for high efficiency, low power consumption, and long-term reliability, the ATS-11F-122-C3-R0 is a perfect choice for applications in a wide range of fields.
The ATS-11F-122-C3-R0 is a flat, horizontally mounted heat sink made from die-cast aluminum. It is designed with a neat appearance and a rounded corner to ensure that it fits in neatly with the current design of the device. The sunken side helps to minimize clutter and improve the overall aesthetic of the device.
The main feature of the ATS-11F-122-C3-R0 thermal - heat sink is its ability to efficiently and evenly dissipate heat from a variety of components. The copper powder-coated frame provides sufficient thermal conductivity, while the plane on the inside of the sink increases heat dissipation. The radial design of the heat sink ensures that it can be used with a range of components with different heat output.
The ATS-11F-122-C3-R0 thermal - heat sink can be used for a wide variety of applications. It has the ability to reduce electronics by up to 20 percent and increase their lifespan. This makes it an ideal choice for electronics industries, such as power suppliers, consumer electronics, automotive, and networking products. The ATS-11F-122-C3-R0 can also be used in medical and laboratory applications where temperature control and safety are of the utmost importance.
The ATS-11F-122-C3-R0 thermal - heat sink is constructed with a number of special features designed to ensure its efficient and effective operation. It is equipped with rubber patting caps to reduce vibration, which reduces noise pollution. The neat aluminium fins further improve the thermal performance of the device. The plane inside the sink increases the speed of heat transfer, while the two heat pipes make sure the heat will be evenly distributed across the sink.
As with all thermal - heat sink designs, the ATS-11F-122-C3-R0 works on a simple principle. The temperatures of all components attached to the sink are increased until they reach the thermal design point. At this point, the heat will be dissipated across the sink and transferred to the surrounding air, keeping the components at a safe and efficient temperature. The increased surface area of the ATS-11F-122-C3-R0 ensures that heat is dissipated quickly and even more efficiently.
The ATS-11F-122-C3-R0 is designed for use in industrial applications where reliable performance is required. The combination of low power consumption, high efficiency, and reliable performance makes the ATS-11F-122-C3-R0 an ideal choice for electronics applications. It is a great choice for applications in power suppliers, consumer electronics, automotive, and networking products. Its ability to evenly dissipate heat and reduce electronics by up to 20 percent make it a must-have device for any industrial application.
The specific data is subject to PDF, and the above content is for reference