| Allicdata Part #: | ATS-11F-128-C1-R0-ND |
| Manufacturer Part#: |
ATS-11F-128-C1-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-128-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-11F-128-C1-R0 is a thermal-heat sink designed for a wide range of applications. It is an active-cooling device which works to keep components within a given temperature range by transferring excess heat away from a component or device. It is used in a variety of industries including electronics, computer electronics, and medical laboratories.
This particular heat sink model is designed to be used in temperatures up to 105°C and with a maximum power dissipation of 128 Watts. It has a black finish with four built-in fins that provide efficient cooling and a standard pin fin design for quick and easy installation. The ATS-11F-128-C1-R0 also features integrated slots to provide extra stability, as well as molded-in electrical mounting tabs, which make electrical connection a breeze. The heat sink is compatible with three different mounting styles: with a clip, a nut, or a stand-off.
The standard application field of the ATS-11F-128-C1-R0 heat sink is the thermal design of electronic, medical, computer, and lighting modules. It is also suitable for use in home and professional lighting fixtures, LED lighting, and other cooling-intensive applications. The device is capable of effectively transferring heat away from components and devices, maintaining a safe operating temperature while protecting delicate circuitry from damage.
The working principle of the ATS-11F-128-C1-R0 heat sink is two-fold. The fins of the device work to dissipate heat away from the source component by drawing ambient cooled air across its surface. The second part of the working principle is the heat transfer pipe, which is made from copper or aluminum and functions as a conduit between the heat source and the heat sink. The heat transfer pipe is designed to efficiently and rapidly move the heat away from the component and into the fins of the heat sink, where it is dissipated into the environment.
When the ATS-11F-128-C1-R0 heat sink is installed and properly maintained, it can result in two major benefits: improved thermal performance and extended component life. This can lead to more reliable operation of electronic, medical, and computer components and can also help to reduce maintenance and energy costs. In addition, the device’s use of a pin fin design along with its efficient cooling capacity helps to increase its performance in a variety of thermal design conditions.
The ATS-11F-128-C1-R0 heat sink is an ideal active-cooling device for a wide range of applications. Its efficient cooling capacity, easy installation, and compatibility with different mounting styles make it a perfect fit for a variety of electronics, computer, and medical applications. With its ability to dissipate heat away from sensitive components and devices and its extended component life, it is an essential component of any professional or home-based thermal design project.
The specific data is subject to PDF, and the above content is for reference