ATS-11F-15-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.52°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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The ATS-11F-15-C3-R0 is a thermal-heat sink developed and produced by the Electronic Packaging Technology Corporation (EPTC). The heat sink is used in many applications, including power management, LED lighting, automotive, computer and consumer electronics. It is also widely used in power conversion, thermal management, and telecommunications applications.The ATS-11F-15-C3-R0 is a full-scale, high-efficiency, thermal-heat sink. It is designed to maximize the performance of a wide range of electronic circuits. The solid aluminum construction offers reliable and long-lasting performance. The EC14-E Copper-clad aluminum fins provide excellent heat transfer surfaces for the optimum thermal interface to the device. The fins are tin-plated for corrosion protection, and they feature a black Nickel oxide coating for enhanced looks.The thermal-heat sink uses a series of channels to direct the heat away from the device and into the surrounding air. The channels are designed to maximize the airflows, allowing for maximum cooling efficiency. In addition, the thermal-heat sink also features a unique waffle design that reduces turbulence, further improving cooling performance.The ATS-11F-15-C3-R0 offers a wide range of features for optimal thermal performance. It has a “quick mount” base that allows for quick and easy mounting of the device without using any additional mounting hardware. It also has Thermal Interface Material compatible handles that help with the installation process. In addition, the ATS-11F-15-C3-R0 comes with optional “Crail” brackets for increased rigidity and reliable operation.The ATS-11F-15-C3-R0 offers excellent thermal performance while maintaining a high level of efficiency. It can be used in a variety of applications, including LED lighting, automotive, power management, computer, and consumer electronics. The device has a highly modular design, making it easy to configure for different applications. The thermal design ensures that heat is effectively dissipated, and that the performance of the device remains consistent with very low levels of heat dissipation.The thermal-heat sink provides efficient heat transfer, and can be used in a variety of applications. It is designed to offer efficient thermal management for LED lighting, automotive, power management, computer, and consumer electronics. Its innovative features provide a reliable and effective solution for cooling various electronic devices. The ATS-11F-15-C3-R0 is an excellent choice for efficient thermal management and optimal cooling performance.

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