| Allicdata Part #: | ATS-11F-16-C3-R0-ND |
| Manufacturer Part#: |
ATS-11F-16-C3-R0 |
| Price: | $ 4.11 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-16-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.73590 |
| 30 +: | $ 3.52842 |
| 50 +: | $ 3.32098 |
| 100 +: | $ 3.11340 |
| 250 +: | $ 2.90584 |
| 500 +: | $ 2.69828 |
| 1000 +: | $ 2.64639 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
The ATS-11F-16-C3-R0 is a thermal-heat sink, designed to dissipate high temperatures generated by components typically found in computing, communication, consumer and industrial applications. This type of heat sink is used in a variety of applications, including thermal solutions for high power electronic components, power modules, fanless computing systems and more.
Application Fields
The ATS-11F-16-C3-R0 is designed to withstand high temperature and high performance applications. It can be used in numerous communication fields as it can dissipate heat from components such as radios, servers, switches, routers, modems, etc. Similarly, it is widely used in consumer electronics to dissipate heat from components such as processors, microprocessors, memory chips, hard disks, etc. Additionally, it is also commonly used in a variety of industrial applications such as laser diodes, SCR, power supplies, precision instruments and more.
Working Principle
The ATS-11F-16-C3-R0 works by being inserted in between a heat-generating component and the heatsink. Heat is generated by the component and is then dissipated through the heat sink. The heat sink functions due to a physical principle called convection, which states that when there is a temperature difference between two objects, the higher-temperature object will transfer heat to the lower-temperature object. This is the same principle as warm air rising, for example. The heat sink is designed specifically to dissipate the heat generated from the component quickly and efficiently.
The ATS-11F-16-C3-R0 is made up of a heat spreader plate, which is made from a metal material like aluminum. The plate contains multiple fins, which enable maximum air cooling for heat dissipation. The plate also has a series of pin-fin holes, which allow the air to circulate swiftly between the component and the heat spreader plate, allowing for efficient heat transfer. Additionally, the ATS-11F-16-C3-R0 comes with a fan, which further increases the air circulation and cooling.
Conclusion
The ATS-11F-16-C3-R0 thermal-heat sink is designed to dissipate high temperatures generated by components found in computing, communication, consumer and industrial applications. It works by being inserted in between a heat-generating component and the heatsink, and uses physical principles such as convection and air circulation to dissipate the heat quickly and efficiently. The ATS-11F-16-C3-R0 is made up of a heat spreader plate and may also come with a fan, for additional air circulation and cooling.
The specific data is subject to PDF, and the above content is for reference