| Allicdata Part #: | ATS-11F-161-C1-R0-ND |
| Manufacturer Part#: |
ATS-11F-161-C1-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-161-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.72°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks can be used in many industrial and commercial applications and they help to transfer heat away from sensitive components. The ATS-11F-161-C1-R0 thermal heat sink is an ideal product for applications requiring a reliable, compact, and cost-effective heat dissipation system. It offers features that make it an ideal choice for many electronic applications.
Design and Construction
The ATS-11F-161-C1-R0 thermal heat sink is designed with an innovative finned top and a base constructed from black anodized aluminum. Each fin on the top is designed to help increase the surface area to allow more efficient heat dissipation. The fin design helps to disperse heat quickly over a larger surface area, reducing the risk of hot spots in the system and providing optimal thermal performance. The base is constructed from Alumaloy, which is anodized for corrosion resistance and durability. This ensures reliability and long life of the heat sink unit.
Technical Specifications
The ATS-11F-161-C1-R0 thermal heat sink has a thermal resistance of 0.37°C/W and a maximum operating temperature of 150°C. It has a base height of 20mm and a fin height of 8.2mm, and a fin width of 15.75mm. The total height of the entire unit is 28.2mm. It is rated for a maximum input power of 21.7W. It also has an air flow rate of 237.5 L/min and an air pressure of 21.7 KBar. The product is UL approved.
Application Fields
The ATS-11F-161-C1-R0 thermal heat sink is ideal for applications requiring a reliable and cost-effective thermal management system. It is suitable for use in industrial and commercial fields, including aerospace, automotive, consumer electronics, and medical electronics. It is suitable for environments that require both air cooling and liquid cooling.
Working Principle
The ATS-11F-161-C1-R0 thermal heat sink works by transferring heat away from sensitive components. It does this by increasing the surface area of the heat sink, allowing more efficient heat dissipation. Heat is dissipated through conduction and convection through the finned top and base of the heat sink. The fins provide a large amount of surface area which quickly disperses the heat away from the top of the component. This helps to keep temperatures stable and prevents hot spots from developing in the system.
Advantages
The ATS-11F-161-C1-R0 thermal heat sink offers several advantages, including cost-effective and reliable heat dissipation, a compact design, and UL approval. Its small size allows it to be easily integrated into electronics and it is ideal for applications requiring a thermal management system with high performance. The black anodized finish of the base ensures excellent corrosion resistance for a long-lasting thermal management solution.
Conclusion
The ATS-11F-161-C1-R0 thermal heat sink is an ideal solution for many commercial and industrial applications. It offers a reliable and cost-effective thermal dissipation system, with a compact design and excellent corrosion resistance. Its finned top and base allow for efficient heat transfer while its small size allows for easy integration into electronics. It is UL approved, ensuring safe operation for any application requiring thermal management.
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