| Allicdata Part #: | ATS19551-ND |
| Manufacturer Part#: |
ATS-11F-164-C2-R0 |
| Price: | $ 5.03 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-164-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.56750 |
| 10 +: | $ 4.44150 |
| 25 +: | $ 4.19479 |
| 50 +: | $ 3.94808 |
| 100 +: | $ 3.70138 |
| 250 +: | $ 3.45462 |
| 500 +: | $ 3.20786 |
| 1000 +: | $ 3.14617 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.41°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential elements of any modern electric or electronic system. Heat sinks are a critical component of any thermal management system and are responsible for providing efficient heat transfer away from sensitive components. The ATS-11F-164-C2-R0 is a heat sink designed for applications which require transfer of higher levels of power.
The ATS-11F-164-C2-R0 is an extruded, natural anodized aluminum heat sink. The heat sink has been designed for easy installation and is lightweight, durable, and corrosion resistant. It features a center pin design which helps increase its thermal performance. It has a square base with a high surface area in order to maximize the transfer of heat away from the component it is attached to. Additionally, the heat sink has an integrated fan guard which can help protect the fan from dust and debris.
The ATS-11F-164-C2-R0 has been designed for use in a variety of applications. It can be used in a range of industrial, automotive, medical, and IT applications. It is also suitable for telecom applications, such as mobile and satellite equipment, and can be used in high-power audio amplifiers and power electronics.
The ATS-11F-164-C2-R0 uses an active cooling system to efficiently dissipate heat away from the component it is attached to. This involves transferring heat away from the component to the heat sink, which then dissipates the heat through its fins. Heat is transferred away from the component through thermal conduction and convection. The heat sink also features integrated fan blades which help to create cool air flow to further enhance its cooling capacity.
The ATS-11F-164-C2-R0 is an excellent choice for applications which require maximum thermal management performance and reliability. It is designed to efficiently dissipate heat away from the component it is attached to, while still offering maximum protection and durability. It is a great choice for any application which requires high performance and reliable thermal management solutions.
The specific data is subject to PDF, and the above content is for reference