| Allicdata Part #: | ATS-11F-165-C3-R0-ND |
| Manufacturer Part#: |
ATS-11F-165-C3-R0 |
| Price: | $ 3.20 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-165-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.91249 |
| 30 +: | $ 2.83395 |
| 50 +: | $ 2.67649 |
| 100 +: | $ 2.51899 |
| 250 +: | $ 2.36157 |
| 500 +: | $ 2.28284 |
| 1000 +: | $ 2.04668 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.63°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat is created by electronic components such as CPUs, Peltier coolers, and even LED lights. As a result, efficient cooling and heat dissipation functions are needed within electronic system designs to prevent damage from overheating. The ATS-11F-165-C3-R0 is an advanced heat sink device from ATS that is designed to keep temperatures down inside an electronic system, helping these components run in a more efficient and reliable manner. In this article, the application field and working principle of the ATS-11F-165-C3-R0 will be explained.
Application Field
The ATS-11F-165-C3-R0 is designed for cooling of specific application fields, such as industrial power electronics, communications, consumer electronics, automotive, medical devices, LED lighting, and other electronic devices. It offers a unique combination of materials, treatments, and shapes that allow it to deliver an optimized heat dissipation performance.
The device also boasts a high-efficiency fin design that enhances its air-cooling function, making it perfect for use in tight spaces between components. Its small footprints make it ideal for use in embedded systems where space is limited. The device can also be used in various environments, such as high-temperature applications due to its construction materials and treatments.
Working Principle
The team at ATS has designed the ATS-11F-165-C3-R0 to work in three distinct ways. The device uses a combination of thermal conductivity, air flow, and the natural convection of air to drive heat away from system components.
First, the device\'s thermal conductive materials help to spread the heat away from the system component and transfer it to the base plate. The device then uses air flow technology to help quickly cool the components. Air is forced through two rows of fins, and the natural convection of the air helps remove the excess heat. Finally, the device has a number of ventilation openings that help dissipate excess heat from the surrounding environment, further increasing the cooling efficiency of the device.
The ATS-11F-165-C3-R0 is an advanced thermal - heat sink device designed to keep temperatures down inside electronic system designs. Thanks to its clever design, the device is able to operate efficiently in a range of different application fields, and delivers an optimized heat dissipation performance. The device utilizes thermal conductivity, air flow, and natural convection of air to drive heat away from system components, making it ideal for use in tight spaces between components. Furthermore, its small footprint makes it ideal for use in embedded systems where space is limited.
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