| Allicdata Part #: | ATS-11F-17-C1-R0-ND |
| Manufacturer Part#: |
ATS-11F-17-C1-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-17-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components used in many areas of modern technology. AAT-11F-17-C1-R0 is a type of heat sink that is designed to meet a wide range of applications. This heat sink has a combination of features that make it suitable for both industrial and consumer applications.
ATS-11F-17-C1-R0 Application Field
The ATS-11F-17-C1-R0 has a wide range of application fields due to its range of features. It can be used in consumer electronics such as laptop computers, cell phones, and other mobile devices. It can also be used in industrial applications for dissipating large amounts of heat from equipment such as machinery, power plants, and medical equipment. It can also be used in automotive applications such as air-cooled engines. It is also widely used in solar and photovoltaic equipment due to its high efficiency.
The ATS-11F-17-C1-R0\'s ability to dissipate large amounts of heat makes it suitable for many industrial applications. It is often used in large machines such as computers, semiconductor production equipment, and laser equipment. It is also used to cool radioactive waste material from nuclear plants.
The ATS-11F-17-C1-R0 is also used in HVAC applications. It can be used to dissipate heat from air conditioning systems. It can also be used to cool large rooms and buildings. In addition, it can be used to reduce the noise from air conditioning systems, and to reduce air pollution caused by HVAC systems.
ATS-11F-17-C1-R0 Working Principle
The ATS-11F-17-C1-R0 operates on a simple principle. It uses turbulent convection to dissipate heat. The materials used in the construction of this heat sink are designed to create a high rate of turbulence, which increases heat transfer. This increases the surface area available to dissipate heat, and allows for faster transfer of heat. The increased amount of turbulence also increases the efficiency of the heat sink.
The ATS-11F-17-C1-R0 also uses passive cooling to further improve the transfer of heat. Passive cooling is a process by which heat energy is transferred away from a surface via radiation and conduction. The heat sink materials are designed to absorb and release heat energy in a controlled manner, allowing them to effectively transfer heat away from the surface.
The ATS-11F-17-C1-R0 is also designed to be highly efficient in terms of energy usage. It does not require the use of a fan or any other cooling system, saving energy and reducing costs. In addition, the heat sink\'s materials resist corrosion, making it durable and long lasting.
Conclusion
The ATS-11F-17-C1-R0 is a thermal-heat sink designed to meet a wide range of applications. It uses turbulent convection and passive cooling to dissipate heat, and its materials resist corrosion, making it highly efficient and durable. The ATS-11F-17-C1-R0 is suitable for both industrial and consumer applications, and is the perfect choice for any application that requires the efficient dissipation of heat.
The specific data is subject to PDF, and the above content is for reference