| Allicdata Part #: | ATS-11F-17-C3-R0-ND |
| Manufacturer Part#: |
ATS-11F-17-C3-R0 |
| Price: | $ 4.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-17-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.80520 |
| 30 +: | $ 3.59415 |
| 50 +: | $ 3.38260 |
| 100 +: | $ 3.17123 |
| 250 +: | $ 2.95982 |
| 500 +: | $ 2.74840 |
| 1000 +: | $ 2.69555 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-11F-17-C3-R0 device is a heat sink designed to improve thermal performance as part of a thermal transfer system. Heat sinks are commonly used in electronics and computer systems to dissipate heat energy, and the ATS-11F-17-C3-R0 is the perfect example of this type of device. This device is designed to be part of a larger heat transfer system, and it is important to understand how it works and the different applications in which it can be used.
The ATS-11F-17-C3-R0 device is made from aluminum and has a grooved, finned surface designed to provide increased surface area. This finned surface increases heat dissipation and ensures that overall system temperatures remain at an optimal level. Additionally, the device is built with a lightweight, low profile design that allows for easy installation and compatibility with most electronics and computer systems.
In terms of its application field, the ATS-11F-17-C3-R0 device is primarily used in applications that require heat dissipation, such as industrial, automotive, computer and electronics systems. It is also suitable for use in indoor or outdoor applications, thanks to the corrosion resistant design of the materials used in its construction. Additionally, the device is designed to be durable and long lasting, providing reliable performance over time.
The working principle of the ATS-11F-17-C3-R0 device is simple but effective. As heat is generated within a system, it travels through the material used in the device until it reaches the surface. The outer surface of the device then disperses the heat energy by means of convection, radiation and conduction. This allows the device to efficiently dissipate the generated heat, improving the overall thermal performance of the system. This is especially useful in computer and electronics systems as this improved thermal performance increases the lifespan of the system and improves the performance of the components.
In conclusion, the ATS-11F-17-C3-R0 device is an effective and reliable thermal transfer device that is suitable for use in a variety of applications. Its aluminum construction ensures durability and its finned design allows for increased surface area to better dissipate heat. Additionally, the device is lightweight and easy to install, making it a great choice for a variety of thermal transfer systems. Understanding how this device works is key to understanding its benefits and ensuring the system remains optimized for maximum performance.
The specific data is subject to PDF, and the above content is for reference