ATS-11F-170-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.02°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

As one of the most important pieces of thermal management equipment, heat sinks are used in a variety of industries to help maintain optimal temperature levels and avoid overheating due to high power electrical components. Heat sinks are devices that help to dissipate the heat generated by electronic components. The ATS-11F-170-C1-R0 is a type of heat sink commonly used to cool electronics in industries ranging from aerospace to medical and consumer goods.

Thermal-Heat Sink Basics

Heat sinks are made up of metal components that increase the surface area available for heat dissipation. The metal parts are arranged to create a large contact point between the heat sink and the external environment, thereby providing the best possible thermal conduction. Heat energy is removed by air or other fluids moving through the heat sink. This process helps to keep the component safe from overheating and minimizes losses due to heat dissipation. The ATS-11F-170-C1-R0 is an example of a thermal-heat sink that utilizes this process.

ATS-11F-170-C1-R0 Overview

The ATS-11F-170-C1-R0 is an aluminum heat sink with full contact thermal conduction. The heat sink is designed with a high thermal conductivity design. This includes an aerogel-filled aluminum core, a special alloy-enhanced aluminum fin, and a special copper heat dissipation plate. The ATS-11F-170-C1-R0 also features recessed fan screws, which increase the air circulation in the heat sink. The fan screws also reduce noise. The ATS-11F-170-C1-R0 can be used in a variety of applications due to its advanced design.

Applications of ATS-11F-170-C1-R0

The ATS-11F-170-C1-R0 is an ideal solution for applications that require a high-performance thermal-heat sink. It is suitable for a variety of industrial applications, such as:

• Aerospace - Satellite systems, cooling equipment, propulsion systems, and lighting systems
• Automotive - Electric and hybrid vehicles, fluid systems, and air conditioning systems
• Consumer electronics - Personal computers, televisions, gaming systems, and smartphones
• Medical - Surgical instruments, patient monitors, and imaging systems

The ATS-11F-170-C1-R0 is also suitable for use in data centers, educational buildings, telecommunications, and other commercial sectors. The heat sink is designed to fit in tight spaces, making it versatile and easy to install.

Working Principle

The ATS-11F-170-C1-R0 utilizes the full contact thermal conduction process to draw heat energy away from the component being cooled. Heat energy is transferred from the component to the heat sink and into the environment through convection. The heat sink is designed with a high thermal conductivity, which helps to maximize the heat transfer rate and minimize the heat losses. The air circulating through the heat sink is generated by the recessed fans, which help to further improve heat dissipation.

Conclusion

The ATS-11F-170-C1-R0 heat sink is an advanced thermal management solution designed for a variety of industries, including aerospace, automotive, consumer electronics, and medical. The high thermal conductivity of the heat sink ensures maximum efficiency and less heat loss, while the recessed fan screws reduce noise and increase air circulation. With its versatile design and efficient heat dissipation, the ATS-11F-170-C1-R0 is an ideal thermal-heat sink solution for optimizing temperature levels in industrial environments.

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