| Allicdata Part #: | ATS-11F-172-C3-R0-ND |
| Manufacturer Part#: |
ATS-11F-172-C3-R0 |
| Price: | $ 3.83 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-172-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.48327 |
| 30 +: | $ 3.38898 |
| 50 +: | $ 3.20078 |
| 100 +: | $ 3.01253 |
| 250 +: | $ 2.82424 |
| 500 +: | $ 2.73009 |
| 1000 +: | $ 2.44766 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks are devices that dissipate heat from other components that require temperature control. The ATS-11F-172-C3-R0 is a Heat Sink that is designed to dissipate heat in low to moderate power applications where air flow is limited, such as electronic enclosures and mobile equipment. It is made of thin aluminum foil with bonded aluminum oxide particles, making it lightweight and easy to install in various applications involving limited air flow.
The ATS-11F-172-C3-R0 is designed to be used in combination with other heat sinks or fan cooling systems, depending on the specific application requirements. It can dissipate heat from a variety of different sources, including heat generated by processors, chipsets, memory, and other electronics components. ATS-11F-172-C3-R0 can even dissipate heat generated by power amplifiers and rectifiers, making it suitable for a wide range of applications.
The ATS-11F-172-C3-R0 is designed to work in tandem with other heat sinks to ensure efficient heat dissipation. This is achieved by the design of the heat sink which has internal grooves that allow air to flow through the heat sink, creating a strong air stream that is directed over the various components that require cooling. In addition to cooling components, the heat sink also helps to keep the temperature of the surrounding air controlled, resulting in a cooler and comfortable working environment.
In addition to its cooling properties, the ATS-11F-172-C3-R0 also offers corrosion and wear resistance. The aluminum foil that makes up the heat sink is resistant to corrosion, and the aluminum oxide particles are bonded to the foil in such a way that they create a protective barrier that prevents the aluminum from being corroded. The protective layer of aluminum oxide particles also provides additional wear resistance, ensuring the heat sink can withstand the continual stress of temperature changes.
The ATS-11F-172-C3-R0 is an ideal solution for applications requiring cooling in low to moderate power applications. Its lightweight design makes it easy to install, and its corrosion and wear resistance ensure a long lasting and reliable performance. Furthermore, its internal grooves enable efficient and effective air flow which ensures the efficiency of the heat dissipation process.
The specific data is subject to PDF, and the above content is for reference