| Allicdata Part #: | ATS-11F-173-C1-R0-ND |
| Manufacturer Part#: |
ATS-11F-173-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-173-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-11F-173-C1-R0 heat sink is an important component for many electronic applications, providing effective cooling and protecting the machine from thermal damage caused by overheating. The design and operation of the ATS-11F-173-C1-R0 make it suitable for various industries and applications, making it a versatile and reliable thermal solution.
The ATS-11F-173-C1-R0 is a flat fin heat sink. It features low-profile, low-cost aluminum fins that dissipate heat away from the component and disperse it into nearby surrounding air. Furthermore, the large fin area and flat corner design helps to achieve effective and uniform surface-to-air heat transfer. It is also able to dissipate multiple sources of heat while reducing the overall operating temperature of the component.
The ATS-11F-173-C1-R0 is constructed of lightweight aluminum with an anodized finish for improved corrosion resistance. It also features a top-mounting hole pattern for convenient installation and mounting. Additionally, the versatile design allows for the use of a variety of coolers, such as a fan, water block, or thermoelectric cooler.
The ATS-11F-173-C1-R0 is designed to provide efficient cooling of a variety of components, including processors, GPUs, FPGAs, chipset components, and other sophisticated electronics. It is made to work in both indoor and outdoor environments in high-humidity conditions, and its large fin area enables it to dissipate large amounts of heat while maintaining a low-profile size.
The cooling performance of the ATS-11F-173-C1-R0 is highly efficient due to its innovative, optimized fin design. The flat fin design maximizes heat transfer while reducing turbulence in air flow. Furthermore, the efficient design helps to reduce fan noise and reduce the overall system power consumption.
The ATS-11F-173-C1-R0 is an ideal component for cooling sensitive and complicated electronics, as it is robust and reliable. Additionally, the standard version is able to meet most common thermal requirements. The heat sink is often used in consumer electronics, medical devices, industrial electronics, and other applications where thermal management is critical.
In conclusion, the ATS-11F-173-C1-R0 heat sink is an effective and reliable thermal solution for a variety of industries and applications. Its flat fin design is optimized for efficient cooling, while its robust construction make it a reliable component. The versatile design allows for the use of various coolers and makes the ATS-11F-173-C1-R0 suitable for numerous applications.
The specific data is subject to PDF, and the above content is for reference