| Allicdata Part #: | ATS-11F-181-C3-R0-ND |
| Manufacturer Part#: |
ATS-11F-181-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-181-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an important component in many industries and applications, and the ATS-11F-181-C3-R0 Heat Sink is no exception. The ATS-11F-181-C3-R0 is designed for a wide range of applications and is capable of cooling larger areas of heat-generating equipment.
The ATS-11F-181-C3-R0 is designed to effectively dissipate the heat generated by products such as high-power lighting systems, power supplies, processor cores, and industrial robots.
The ATS-11F-181-C3-R0 consists of a base plate made from brazed aluminum and a heat sink. The heat sink is made up of aluminum fins that extend downwards from the base plate. This allows for maximum surface area to dissipate heat generated by the product into the surrounding environment. The ATS-11F-181-C3-R0 also has a built-in fan that allows the heat sink to efficiently cool the product.
The ATS-11F-181-C3-R0 has a large, robust base plate that is designed for static pressure and superior contact force between the heat-generating product and the heat sink. Additionally, the base plate is coated in a layer of aluminum oxide, which helps to improve thermal conductivity. This ensures that the heat is efficiently dissipated from the product and does not cause unnecessary stress on the product.
The heat sinks of the ATS-11F-181-C3-R0 come with a wide variety of cooling fins for different applications. The fins are designed to maximize the surface area and ensure that the heat generated is quickly transferred away from the product and into the surrounding environment. These cooling fins also have angled edges which further increases heat transfer and the overall cooling effect of the heat sink.
The fan of the ATS-11F-181-C3-R0 is powered by a DC motor and is capable of dissipating heat from larger areas than the fins alone. The fan is designed to maintain a consistent air flow and is adjustable to meet different cooling needs for specific types of products. Additionally, the fan is capable of operating at different speeds to ensure that the most efficient cooling is achieved.
The ATS-11F-181-C3-R0 is designed to operate efficiently with temperatures ranging from 0°C to 180°C. Additionally, the design allows for the heat sink to be easily mounted on flat surfaces or in tight spaces such as those found in embedded systems. This makes the ATS-11F-181-C3-R0 an ideal solution for many different types of applications and industries.
The ATS-11F-181-C3-R0 Heat Sink is an efficient and reliable solution for cooling the heat generated by products such as lighting systems, power supplies, and processor cores. The design of the heat sink ensures maximum surface area for heat transfer and its fan and fins are designed to provide efficient cooling even in tight spaces. By taking advantage of these features, the ATS-11F-181-C3-R0 can effectively cool larger areas of heat-generating products while still providing an efficient cooling solution for a variety of different industries.
The specific data is subject to PDF, and the above content is for reference