| Allicdata Part #: | ATS-11F-197-C3-R0-ND |
| Manufacturer Part#: |
ATS-11F-197-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-197-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sink is a kind of device to transfer thermal energy from the source to the surrounding environment, which is widely used in various heat-dissipation applications. The ATS-11F-197-C3-R0 thermal heat sink is one of the most widespread and reliable products available in the market nowadays.
This heat sink has the structure of multiple extended fins, resembling petals of a lotus flower, to facilitate the maximum heat transfer to the surrounding environment. It is designed with dissipating fins made of high thermal conductivity aluminum alloy for faster heat dissipation. These fins are filled with oxygen-free soft copper tubes for uniform distribution of the hot air, enabling faster heat transfer rate. The fins are arranged neatly in order to provide good heat transfer efficiency.
This heat sink is also equipped with two thermal-conductive rubber pads to reduce air gap so that heat can be dissipated quickly. In addition, it comes with two mounting screws on the back side which makes it easy to install and operate. This heat sink is suitable for any electronic device which requires efficient heat dissipation.
ATS-11F-197-C3-R0’s working principle is based on the thermal dynamics of thermoelectric materials which convert temperature energy into electrical energy when the element is connected to two different heat sources. This effect is called “Seebeck effect”. The aluminum fins of the heat sink absorb heat from the heat source and dissipate it to the surrounding environment. The heat absorbed by the fin is transferred to the copper tubes through the thermal conducting rubber gasket and then to the surrounding environment.
This heat sink can be used in different applications such as in industrial process, mechanical engineering, automotive engineering, electrical engineering, and even in the electronics industry. It can be used to cool the computers, power sources, audio amplifiers, LCD monitors, or any other electronic products which need to reduce heat. It is also used for cooling small electric devices such as LED lamps, Portable Digital Media Players (PDAs), and even mobile phones.
The ATS-11F-197-C3-R0 thermal heat sink is a reliable and well-designed device suitable for many electronic devices and applications. With its simple and easy installation, it is one of the most preferred heat sinks in the industry today.
The specific data is subject to PDF, and the above content is for reference