ATS-11F-198-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.472" (12.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.21°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-11F-198-C3-R0 Thermal Heat Sinks

Thermal heat sinks, otherwise known as thermally conducted aluminum products, are special type of material or device used for the purpose of transferring heat away from critical components and dissipating it safely. These components come in an array of sizes, configurations and shapes, depending on the type of device or components that is being cooled. The ATS-11F-198-C3-R0 is a thermal heat sink that’s designed for various applications.

The ATS-11F-198-C3-R0 thermal heat sink is designed for use in devices that need effective thermal management. It’s constructed using a high-grade aluminum alloy that has exceptional thermal properties. Its fins feature a lightweight design but are highly durable and can withstand high temperatures. This thermosink has a built-in fan system that helps to improve its cooling performance. The fan runs on low power consumption and provides efficient cooling for the device it is installed in.

The ATS-11F-198-C3-R0 thermal heat sink is capable of providing efficient cooling for a variety of applications. It is commonly used in laptops, computers and other electronic devices which require efficient heat transfer, such as power supplies, video cards, processors, graphics cards and motherboards. This thermal heat sink is also capable of cooling audio equipment, LED light bulbs, digital cameras and other electronic components. It can also be used to cool high-end gaming consoles.

The working principle of the ATS-11F-198-C3-R0 thermal heat sink is to use conduction, convection and radiation to transfer thermal energy from the heat source to the surrounding environment. Thermal conduction occurs when heat is transferred from one object to another through direct contact, while thermal convection is the heat transfer caused by the movement of molecules in a fluid. Finally, radiation is the transfer of heat through electromagnetic waves.

The ATS-11F-198-C3-R0 thermal heat sink is an effective and efficient cooling method, allowing components to work more efficiently while also minimizing their risk of damage due to overheating. The built-in fan helps to improve ventilation and circulate air in the device, allowing for better cooling. This type of thermal heat sink can be used in both larger and smaller components, providing the same amount of cooling regardless of the size.

The ATS-11F-198-C3-R0 thermal heat sink is a cost-effective and reliable method of cooling. It is designed with durability and quality in mind, providing superior performance and years of reliable use. This thermal heatsink is an excellent choice for any device or component that requires effective and efficient cooling. Their versatility makes them suitable for many applications, from laptops to gaming consoles, and their quality guarantees years of reliable service.

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