| Allicdata Part #: | ATS-11F-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-11F-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important aspect of engineering practice. Proper heat management is vital to the success of any product or system. Heat sinks are an important type of thermal management component used to reduce the temperature of a component or system by dissipating heat away from them. One such type of heat sink is the ATS-11F-20-C3-R0.
The ATS-11F-20-C3-R0 is a unique type of heat sink with a range of application fields. It is specifically designed for the extremely high temperatures and demanding applications that come with high-performance electronics and some advanced military systems. It can also be used in many other industries, including semiconductor, nuclear, medical, aerospace and automotive. It is also used in many products such as LED lighting and complex electronic components such as processors.
The ATS-11F-20-C3-R0 utilizes a variety of features that make it an ideal choice for thermal management. It is constructed from anodized aluminum islets and has a high thermal conductivity that can be as much as six times greater than copper. Additionally, it’s designed with a shape that is optimized for maximum air flow and heat dissipation. The aluminum islets are connected to each other with press-fit pins and are designed to stand up to high temperature and loads. The heat sink is also designed with special insulation to protect any components from damage caused by high temperatures.
The ATS-11F-20-C3-R0 has a variety of features that makes it an ideal choice for a wide range of applications. This heat sink is designed to be light weight yet durable, and is equipped with a number of features that make it an easy to install and maintain. It is specifically designed to provide enhanced thermal management performance, as well as to facilitate air flow enhancement. Additionally, the material used in the construction of this heat sink is designed to optimize thermal conductivity. This material also exhibits superior resistance to corrosion and oxidation.
The ATS-11F-20-C3-R0 is a highly advanced and reliable heat sink and has a range of specialized working principles. It is designed to maintain an optimal temperature by efficiently dissipating heat away from components or systems. This heat sink utilizes advanced materials such as aluminum islets, which have been designed to stand up to high temperatures and loads. It can also be used with or without additional insulation layers to further enhance the thermal performance and protection of the underlying components.
The ATS-11F-20-C3-R0 is an effective tool for efficient thermal management. It is designed to provide enhanced thermal performance, and it has been specifically designed for environments with very high temperatures and demanding applications. It is lightweight and can be easily installed and maintained. Additionally, the thermal conductivity of the heat sink is greatly enhanced, and it is designed to be corrosion and oxidation resistant. All of these features make the ATS-11F-20-C3-R0 an ideal choice for a range of thermal management applications.
The specific data is subject to PDF, and the above content is for reference