| Allicdata Part #: | ATS-11F-200-C3-R0-ND |
| Manufacturer Part#: |
ATS-11F-200-C3-R0 |
| Price: | $ 3.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-200-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.45933 |
| 30 +: | $ 3.36588 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of complex electronics such as embedded systems, medical imaging, and telecommunications technologies often necessitates the use of efficient and reliable thermal solutions. The ATS-11F-200-C3-R0 is a versatile heat sink designed to provide excellent thermal solutions in applications such as servers, laptops, tablets, embedded systems, and more.
The ATS-11F-200-C3-R0 is designed with a number of features to ensure efficient heat transfer. The thermal fins are designed in a folded design to maximize surface area and minimize the amount of space needed. The fins are also designed with a black-anodized surface treatment to reduce staining and corrosion and increase longevity. The heat sink also features a baseplate with an integral groove that creates channels within the baseplate itself, which allows for greater heat dissipation and ensures that heat is dispersed in an even fashion across the entirety of the heat sink.
The ATS-11F-200-C3-R0 is designed to work with a variety of power supplies and fan systems. It is compatible with the latest Intel CPU and AMD socket standards, and can support a number of different fan sizes. This allows the ATS-11F-200-C3-R0 to accommodate many types of cooling requirements, providing a flexible solution for those seeking to control warm temperatures in various scenarios.
The ATS-11F-200-C3-R0 utilizes a thermal impedance rating system to measure its performance. Thermal impedance is a way to quantify how effective a heat sink is at conducting heat away from a device. The higher the thermal impedance rating, the less effective the heat sink is at dissipating heat. The ATS-11F-200-C3-R0 has a thermal impedance of 0.24°C/W, making it one of the most efficient thermal solutions available.
The ATS-11F-200-C3-R0 is designed to be easy to install and maintain, making it a popular choice for those seeking an efficient, reliable heat sink solution. The heat sink is available in a variety of sizes to accommodate various cooling requirements, and comes with mounting screws and a thermal thermal thermal compound for easy installation. Additionally, the ATS-11F-200-C3-R0 is compatible with a number of airflow solutions, ensuring that the heat is directed away from the device and into the surrounding environment.
The ATS-11F-200-C3-R0 is an effective heat sink solution for a variety of applications, and is especially suited for use in embedded systems, medical imaging equipment, telecommunications technologies, and other applications where thermal efficiency is paramount. With its high thermal impedance rating, simple installation and maintenance instructions, and a variety of fan sizes to choose from, the ATS-11F-200-C3-R0 is an ideal choice for those looking for an efficient thermal solution.
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