| Allicdata Part #: | ATS19601-ND |
| Manufacturer Part#: |
ATS-11F-21-C2-R0 |
| Price: | $ 5.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-21-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.04000 |
| 10 +: | $ 4.90455 |
| 25 +: | $ 4.63176 |
| 50 +: | $ 4.35935 |
| 100 +: | $ 4.08694 |
| 250 +: | $ 3.81448 |
| 500 +: | $ 3.54201 |
| 1000 +: | $ 3.47390 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 16.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-11F-21-C2-R0 is a type of thermal – heat sinks that are commonly used for data processor solutions. It uses a combination of proven, advanced technology and materials to produce a highly efficient, low-cost cooling system.
The ATS-11F-21-C2-R0 heat sink is made from a combination of high quality materials including copper fins and aluminum base. The copper fins are tightly packed together and have been made with precise spacing and angled construction to maximize the thermal performance of the heat sink. This design also reduces the amount of noise created during operation. The aluminum base is a much lighter weight material than the copper and provides an even distribution of heat away from the processor. In addition, the aluminum also helps to dissipate heat faster than other materials.
The ATS-11F-21-C2-R0 heat sink is designed to support high heat loads. It has been specifically designed with a stepped profile to reduce the amount of heat that is concentrated in a small area, and to improve overall thermal performance. This design also helps to keep the base plate in the correct position for the processor and the fan. The wide spacing between the fins helps to provide good airflow and to reduce the amount of noise created by the fan.
The ATS-11F-21-C2-R0 heat sink has been designed to be used with a variety of chip sets and socket types. This type of heat sink is commonly used for data processor solutions and its design is optimized to support these types of applications. The heat sink is capable of supporting high heat loads and it is designed to reduce the amount of noise that is produced. This heat sink is also designed to be used with active cooling solutions such as air and water cooling.
The ATS-11F-21-C2-R0 heat sink is an effective solution for data processor applications. Its combination of high quality materials, precise spacing, and stepped design result in a reliable and efficient cooling system. The heat sink has been specifically designed to support high heat loads and to provide an even distribution of heat away from the processor. In addition, it also helps to reduce the amount of noise that is produced. This type of heat sink is commonly used for data processor solutions and its design is optimized to support these types of applications.
The specific data is subject to PDF, and the above content is for reference