ATS-11F-25-C2-R0

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1 Introduction

ATS-11F-25-C2-R0 is a high performance Thermal-Heat Sink component developed by the American-based Jameco Electronics. It ensures a safe and efficient thermal transfer from a high-powered device to its surrounding environment. This product is designed with a combination of materials and engineering optimization to decrease thermal resistance and dissipate heat more effectively than traditional passive cooling methods. It is a great choice for hot spots and high power applications.

2 Application Field

ATS-11F-25-C2-R0 is mainly applied in applications that require high power and high temperature cooling solutions. The thermal-heat sink has an efficient heat transfer performance in many areas, such as high current power supplies, switching power supplies, and other high-powered devices, like CPUs, GPUs, or power transistors. It also works extremely well for LED projectors used in medical, industrial, and entertainment fields.

3 Working Principle

The working principle of ATS-11F-25-C2-R0 is based on the design of two distinct parts: the base, which is made from a high-quality aluminum alloy, and the fin, which is made from a high-grade copper material. These two pieces are thermally bonded together to give the component a high-temperature dissipation performance. The aluminum base contains a thermal adhesive and is integrated with a heat pipe to rapidly transfer any additional generated heat away from the component. The fin further increases the heat dissipation by acting as a radiator, allowing for air to come into contact with the air-borne heat and evaporating the hot air away from the fin. The fin also ensures that the heat transfer to the environment is even and consistent, while reducing the temperature of the component.

4 Components

ATS-11F-25-C2-R0 thermal-heat sink is composed of two main components: a base and a fin. The base is made of a high-quality aluminum alloy that is thermally bonded to the fin made of high-grade copper material. The aluminum base contains a thermal adhesive and is also integrated with a heat pipe to rapidly transfer any additional generated heat away from the component. The fin is designed to increase the heat dissipation and act as a radiator that allows air to come into contact with the air-borne heat. The fin reduces the temperature of the component and ensures that the heat transfer to the environment is even and consistent.

5 Benefits

The main benefit of ATS-11F-25-C2-R0 is its superior heat transfer and cooling performance. It works extremely well for LED projectors used in medical, industrial, and home entertainment fields. This thermal-heat sink is designed with a combination of materials and engineering optimization to decrease thermal resistance and dissipate heat more effectively than traditional passive cooling methods. By minimizing temperature variations, it will also extend the operational life of the device. In addition, the fin of the ATS-11F-25-C2-R0 also ensures that the heat transfer to the environment is even and consistent.

6 Conclusion

ATS-11F-25-C2-R0 is a high performance Thermal-Heat Sink component developed by the American-based Jameco Electronics. It is mainly applied in applications that require high power and high temperature cooling solutions. The thermal-heat sink is composed of two components (aluminum base and copper fin) that are thermally bonded together, providing a superior heat transfer and cooling performance. The fin of ATS-11F-25-C2-R0 also ensures that the heat transfer to the environment is even and consistent, while minimizing temperature variations and extending the operational life of the device.

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