| Allicdata Part #: | ATS-11F-29-C1-R0-ND |
| Manufacturer Part#: |
ATS-11F-29-C1-R0 |
| Price: | $ 6.83 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-29-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.14187 |
| 30 +: | $ 5.80083 |
| 50 +: | $ 5.45958 |
| 100 +: | $ 5.11831 |
| 250 +: | $ 4.77709 |
| 500 +: | $ 4.43586 |
| 1000 +: | $ 4.35056 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are devices used to dissipate heat away from components or systems in order to prevent thermal overload, and the ATS-11F-29-C1-R0 is no exception.
The ATS-11F-29-C1-R0 is a highly effective and efficient thermal-heat sink, designed for maximum airflow and high performance. According to the manufacturer, the heat sink features a robust aluminum body with enhanced fin construction, providing excellent heat dissipation. The slim profile of the sink allows for easy installation in most devices, and it can be fitted with a variety of fan sizes to tailor cooling performance to your individual requirements. Additionally, a quiet operation and low power draw make the ATS-11F-29-C1-R0 an ideal choice for most applications.
The working principle of the ATS-11F-29-C1-R0 is quite simple. Heat is transferred from the components or system to the heat sink, and it is then dissipated into the surrounding air. This process is achieved primarily through air convection, which is the transfer of heat through the air. In the ATS-11F-29-C1-R0, air is drawn in and over the fins of the heat sink, where the hot air is cooled by the fins. After cooling, the air is released back into the system, reducing the temperature of the components and allowing the system to remain cool.
The ATS-11F-29-C1-R0 is an ideal choice for many different applications, owing to its slim design, efficient cooling performance, and quiet operation. It can be used in a variety of industries, such as automotive, industrial control, and commercial electronics. Additionally, it can be used in computing, networking, and consumer electronics, as well as other applications where cooling performance is an essential factor in the operation of the device. Due to its reliable thermal performance and low power draw, the ATS-11F-29-C1-R0 is an excellent choice for a heat sink that offers superior cooling and efficient performance.
In summary, the ATS-11F-29-C1-R0 is a high-performance thermal-heat sink that offers superior cooling performance, quiet operation, and low power draw. It can be used in a variety of industrial, commercial, and consumer electronics applications, and is an ideal choice for most cooling needs. Thanks to its superior cooling performance and efficient operation, the ATS-11F-29-C1-R0 is an excellent choice for a thermal-heat sink.
The specific data is subject to PDF, and the above content is for reference