| Allicdata Part #: | ATS-11F-48-C3-R0-ND |
| Manufacturer Part#: |
ATS-11F-48-C3-R0 |
| Price: | $ 3.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-48-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.47004 |
| 30 +: | $ 3.27726 |
| 50 +: | $ 3.08448 |
| 100 +: | $ 2.89170 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.50614 |
| 1000 +: | $ 2.45794 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are used in all kinds of engineering applications for heat dissipation. ATS-11F-48-C3-R0 is a type of heat sink which offers superior efficiency when it comes to dissipating heat.
It is made from aluminum alloy, which helps in making it highly conductive and durable. It is designed in such a way that it can be easily used in different types of engineering projects. The ATS-11F-48-C3-R0 is capable of providing better performance than other conventional heat sinks.
The ATS-11F-48-C3-R0 is a very popular heat sink because of its affordability and low maintenance. It is designed to be used in places where there is a limited space, as it can fit into a small area. It also has an impressive thermal performance, which makes it suitable for applications which require high thermal performance.
The ATS-11F-48-C3-R0 has an efficient design which helps in dissipating heat quickly. This makes it much easier to manage and maintain in the long run. The design also allows for more efficient airflow, which further improves its heat dissipation capacity.
The ATS-11F-48-C3-R0 has many different applications. It can be used in a wide range of engineering projects, ranging from compact and low-power solutions to much larger applications. Some of the applications include automotive, aerospace, consumer electronics, industrial automation and medical device products.
The ATS-11F-48-C3-R0 is used primarily for transferring heat away from components and dissipating it into the surrounding environment. It does this by taking advantage of the natural cooling effect of air on the surrounding components. Its simple design ensures that it is able to offer maximum cooling efficiency in any given environment.
The ATS-11F-48-C3-R0 is also an excellent choice for designs that involve a large amount of heat transfer. Its almost unlimited surface area helps to quickly dissipate the heat produced from the components, thus helping to keep the components running at their optimum temperature.
The ATS-11F-48-C3-R0 is a highly efficient thermal solution that is perfect for applications which require minimal space and maximum cooling performance. Its high efficiency and low cost makes it an attractive choice for any application. However, it is important to note that it is not suitable for applications that involve extreme temperatures or high-power densities.
The specific data is subject to PDF, and the above content is for reference