| Allicdata Part #: | ATS-11F-50-C3-R0-ND |
| Manufacturer Part#: |
ATS-11F-50-C3-R0 |
| Price: | $ 3.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-50-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.22182 |
| 30 +: | $ 3.13467 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are popularly used to dissipate heat from hot components, allowing them to work efficiently without overheating and ruining internal equipment. The ATS-11F-50-C3-R0 is a thermal shunt, manufactured by aPalvar Inc, that is designed specifically to do just this. The ATS-11F-50-C3-R0 allows for efficient heat dissipation between different surfaces, such as a PCB board and system enclosure, thereby reducing heat build up and enabling components to work properly.
The ATS-11F-50-C3-R0 is a small thermal shunt that measures just 30×20 mm2. It is designed to be placed between two surfaces, such as between a PCB board and system enclosure. This helps to dissipate the heat build up, as the heat that builds up on one surface is absorbed and dissipated to the opposite surface. The ATS-11F-50-C3-R0 provides excellent thermal shunt efficiencies of up to 50%. This is done through its specially designed thermal pad, which provides uniform distribution, heat absorption, and high thermal performance.
The ATS-11F-50-C3-R0 can be used in a wide range of applications. It can be used in computers, telecom equipment, home appliances, power electronics, and other industrial and consumer electronics. It is designed to absorb the heat generated by components and dissipate it from the system, thereby preventing overheating and damage to the internal components.
The working principle of the ATS-11F-50-C3-R0 is quite simple. When the thermal pad, which is connected to two opposing surfaces, absorbs the heat from one of the surfaces, it transfers and stores the heat. This heat is then dissipated to the opposite surface at a slower rate. As the rate of heat absorption is slower than the rate at which it is being dissipated, the overall temperature of the component remains relatively constant. This allows for efficient heat dissipation and prevents any overheating issues, as the stored up heat is dissipated away efficiently.
In conclusion, the ATS-11F-50-C3-R0 is a very efficient thermal shunt, designed to dissipate heat between two surfaces. It is small in size and highly efficient, offering up to 50% thermal shunt efficiency. This allows for efficient heat dissipation, thereby ensuring that components and boards do not overheat and cause any damage to the system. It is suitable for use in a range of applications, such as computers, telecom equipment, home appliances, power electronics, and other industrial and consumer electronics.
The specific data is subject to PDF, and the above content is for reference