| Allicdata Part #: | ATS-11F-55-C3-R0-ND |
| Manufacturer Part#: |
ATS-11F-55-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-55-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 24.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is one of the most important aspects of any electronic system. It requires precise control of temperature and airflow at the component level. Heat sinks are devices that dissipate heat from components, preventing overheating and maximizing performance. The ATS-11F-55-C3-R0 is a high performance thermal heat sink designed to provide superior cooling performance in the most demanding applications.
The ATS-11F-55-C3-R0 is a copper, finned heat sink featuring a black anodized aluminum mounting clip with four mounting holes. It is designed to dissipate up to 55 watts of heat with a minimal amount of space, providing crisp cooling performance in a densely packed environment. The flexible clip and four-point mounting design allow for easy integration with standard mounting holes, making installation a breeze.
The ATS-11F-55-C3-R0 features a low-profile design, with no outcropping components. This ensures that no part of the heat sink will protrude into other components, thereby reducing any negative impact on the device’s performance. The device also features a radial fin pattern, which increases the surface area for heat dissipation, ensuring that it is able to provide superior cooling performance in all applications.
The ATS-11F-55-C3-R0 is designed to operate in a wide range of temperatures, from -40°C to +95°C. The device is rated to dissipate up to 55W of heat, making it an ideal choice for high power applications such as LED lights, power supplies, and motor drivers. The device’s flexible mounting clip also allows it to be used in applications with limited space or other constraints.
The ATS-11F-55-C3-R0 is designed to work in two distinct stages: conduction and convection. First, heat is conducted from the component to the heat sink with very low thermal resistance. Then, the fin pattern of the ATS-11F-55-C3-R0 allows air to flow around the fins and carry away heat, which is then dissipated into the environment through convection. This two-stage process ensures that the device is able to provide superior cooling performance in the most demanding applications.
The ATS-11F-55-C3-R0 is an ideal choice for applications that require a high-powered, low-profile, space-saving cooling solution. Its combination of superior thermal performance, low-profile design, and flexible mounting clip make it a great choice for applications that require efficient cooling without taking up too much space.
The specific data is subject to PDF, and the above content is for reference