| Allicdata Part #: | ATS-11F-64-C1-R0-ND |
| Manufacturer Part#: |
ATS-11F-64-C1-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-64-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are important tools in engineering. They are essential for managing and controlling heat in electrical and thermal systems. Heat sinks are devices designed to dissipate heat by transferring thermal energy away from an object. The most common type of heat sink device is the heat pipe. ATS-11F-64-C1-R0 is a highly efficient heat sink designed for use in computer and communication systems.
The ATS-11F-64-C1-R0 is a fanless heat sink that utilizes a combination of copper fins and a convection surface to efficiently disperse heat from the device. It is capable of dissipating up to 150 watts of thermal energy. The fanless design makes the ATS-11F-64-C1-R0 lightweight, low-noise, and extremely reliable.
The ATS-11F-64-C1-R0 heat sink is designed to work in two main applications: high performance computing and telecom systems. In a high performance computing system, the heat sink is used to improve the efficiency of processor and memory modules by dissipating heat generated by them. In a telecom system, the heat sink is used to cool the unit\'s radio and FET components.
The working principle of the ATS-11F-64-C1-R0 heat sink is thermal conduction. It absorbs the generated heat from the processor or FET and then disperses it away from the source through the copper fins. A convection fan is then placed on top of the fins, which helps to draw the heat away. By utilizing convection, the heat is dissipated away from the device and safely out of the system.
The ATS-11F-64-C1-R0 heat sink is a highly efficient and reliable cooling tool for high performance computing and telecom systems. It utilizes a combination of copper fins and convection technology to dissipate heat generated by processors and FETs. This heat sink is designed to be lightweight, low-noise, and highly reliable and is capable of dissipating up to 150 watts of thermal energy.
The specific data is subject to PDF, and the above content is for reference