| Allicdata Part #: | ATS-11F-70-C3-R0-ND |
| Manufacturer Part#: |
ATS-11F-70-C3-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11F-70-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.22163 |
| 30 +: | $ 3.98727 |
| 50 +: | $ 3.75278 |
| 100 +: | $ 3.51823 |
| 250 +: | $ 3.28369 |
| 500 +: | $ 3.04914 |
| 1000 +: | $ 2.99050 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks play an important role in dissipating heat from various electronic systems. The ATS-11F-70-C3-R0 is a specialized heat sink designed for applications where there is a need for increased thermal performance. This heat sink can be used in systems such as communications, telecommunications, industrial control, and automotive electronics where there is a need for a reliable temperature control solution.
The ATS-11F-70-C3-R0 is a thermal-heat sink that is composed of a metal core with two externally facing surfaces. The core is made up of aluminum or copper, and has a variety of internal fins which increase its capacity of heat dissipation. The external surfaces are covered with a finned aluminum or copper cover plate which helps to dissipate heat quickly.
The heat sink works on a simple principle - as heat is generated in an electronic system, it is absorbed by the heat sink and transferred to the environment through radiation and conduction. The fins are designed in such a way that allows the air to flow through them, carrying away the heat and leaving the electronic system cool. This heat transfer process makes it an ideal choice for cooling applications where space is limited and extra heat dissipation is necessary.
The ATS-11F-70-C3-R0 is designed for a huge variety of applications. It can be used in devices such as switchgear, microprocessors, medical electronics, and telecommunications systems. Because of its excellent thermal performance, it can also be used in high-power, high-temperature systems, such as those found in motor control and power electronics.
The ATS-11F-70-C3-R0 heat sink offers a number of advantages over other types of heat sinks. It is lightweight, has a high thermal conductivity, is resistant to corrosion, and is able to transfer heat quickly and efficiently. With an operating temperature range of -55 to +175 degrees Celsius, this heat sink is also perfect for extreme temperature applications. In addition, it is easy to install, and is compatible with a wide range of mounting options.
The ATS-11F-70-C3-R0 heat sink is perfect for applications requiring high thermal performance in a compact form. It is reliable, durable, and requires minimal maintenance. This makes it an ideal choice for applications such as industrial automation, medical electronics, and telecommunications.
The specific data is subject to PDF, and the above content is for reference