ATS-11F-98-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	15.29°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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What is ATS-11F-98-C1-R0?

ATS-11F-98-C1-R0 is a type of thermal-heat sink, a device used to dissapate and remove heat from electronic components. The ATS-11F-98-C1-R0 works by utilizing an anodized aluminum frame and a heat spreader technology. This makes it well suited for applications that require high thermal efficiency and uniformity.

Application Fields of the ATS-11F-98-C1-R0

The ATS-11F-98-C1-R0 is designed primarily for use in high-pressure telecommunications and industrial settings. Because of its anodized aluminum frame and heat spreader technology, the ATS-11F-98-C1-R0 consistently achieves excellent thermal performance in these demanding applications. Additional application fields utilizing the ATS-11F-98-C1-R0 include:

• Computer thermal insulation
• High-current control systems
• Power electronics
• Power conversion
• LED lighting
• Medical devices

Working Principle of ATS-11F-98-C1-R0

The ATS-11F-98-C1-R0 dissipates heat from electronic components in a number of different ways. The main principle involved is that of convection, where a stream of air is circulated around the heat sink. The air moves away from the points of heat radiation in the electronic device, taking the heat with it. This process is further enhanced by the anodized aluminum frame, which increases the surface area of the heat sink and thereby enhances heat radiation. Additionally, heat is rapidly dissipated from the heat sink due to its unique heat spreader technology, which either bounces or diffuses the heat away from the heat source. The result is that the electronics are kept as cool as possible.

Advantages and Limitations of ATS-11F-98-C1-R0

The ATS-11F-98-C1-R0 thermal-heat sink is an excellent choice for dissipating and removing heat from electronic components in a variety of settings. Some of its advantages include:

• High thermal efficiency
• Excellent heat spreader technology
• High uniformity
• Compact design

However, the ATS-11F-98-C1-R0 does have certain limitations that must be taken into consideration when selecting a thermal-heat sink. Some of its limitations include:

• Relatively low heat dissipation rates
• Higher noise levels than traditional heat sinks
• The anodized aluminum frame increases weight and raises production costs

Conclusion

In conclusion, the ATS-11F-98-C1-R0 is an excellent choice for removing heat from electronic components in high-pressure telecommunications and industrial settings. Its anodized aluminum frame and unique heat spreader technology offer exceptional thermal performance, ensuring that your electronics remain cool and stable. However, it does have certain limitations which must be taken into consideration when selecting a thermal-heat sink.

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