| Allicdata Part #: | ATS-11G-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-11G-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an essential component in any electronics system. In order to ensure reliable operation, heat must be reliably dissipated from components that generate heat due to their operation. ATS-11G-10-C1-R0 Heat Sink is a highly efficient heat sink design that helps dissipate heat and keep the interior of your system cool. It is capable of dissipating up to 10 Watts of heat from the device it is attached to.
The ATS-11G-10-C1-R0 Heat Sink is ideal for applications in which thermal management is of utmost importance. Its design has excellent thermal resistance values that guarantee maximal performance. By dissipating heat quickly, this heat sink can prevent the device it is attached to from reaching dangerous temperatures and potentially causing damage.
The ATS-11G-10-C1-R0 Heat Sink is designed with an optimized number of fins, increasing surface area without adding too much weight or size. It is also designed with a unique ribbing pattern, which increases its overall efficiency. The heat sink also features a high-temperature aluminum alloy base which is highly resistant to corrosion, making it suitable for use in harsh environments.
The internal working principles of the ATS-11G-10-C1-R0 Heat Sink are fairly simple. To start, an external force is used to transfer heat from the device it is attached to into the fins of the heat sink. Whenever the temperature of the device starts to exceed the optimal level, the heat travels through the fins, and is then dissipated by convection of the surrounding air. The outside area of the fins then warm up, taking away the heat that was generated, thus keeping the interior of the system cool.
The ATS-11G-10-C1-R0 Heat Sink is highly effective at keeping electronics cool, and is suitable for use in various applications. It is particularly useful in industries such as automotive, medical, military, and communications, that require extremely reliable thermal management systems. Furthermore, its effective design allows for greater efficiency due to the higher surface area coverage, giving it an advantage over other heat sink designs.
Overall, the ATS-11G-10-C1-R0 Heat Sink is a cost-effective and reliable solution for applications where thermal management is paramount. Its robust design ensures consistent operation in harsh environments, while also providing enhanced heat dissipation. With an optimized design and heat dissipation capabilities, it is certainly a thermal solution worth considering.
The specific data is subject to PDF, and the above content is for reference