| Allicdata Part #: | ATS-11G-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-11G-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential component of electronic systems. Thermal heat sinks, such as the ATS-11G-10-C3-R0, are a crucial part of this system. The ATS-11G-10-C3-R0 is part of a series of products from the same company, designed to move heat away from electronic components and prevent them from overheating. The ATS-11G-10-C3-R0 has a broad application field and a specific working principle.
The ATS-11G-10-C3-R0 has a wide variety of applications. It is a universal heat sink, so it can be used in almost any electronic system. It is suitable for use in heating and air conditioning systems, medical equipment, consumer electronics, and many other types of applications. It can be used to cool a large number of components, such as transistors, integrated circuits, and other components that generateheat.
The ATS-11G-10-C3-R0 works by using a combination of heat conduction and convection. It works by transferring heat away from the components by conduction and convection. The device has a small fan that draws in air from the environment and forces it over the heat-conductive surfaces of the device. This draws the heat away from the components and dissipates it into the air.
The ATS-11G-10-C3-R0 also has some unique features that make it an ideal choice for electronic systems. It is designed with special heat-conductive materials that allow maximum heat transfer from the components, while still having low noise levels. In addition, it has a low profile, meaning that it can be easily installed in tight spaces.
The ATS-11G-10-C3-R0 is a great choice for any application that needs thermal management. It is capable of transferring heat away from the components, while still having low noise levels and a low profile. It is also easy to install and is suitable for many different types of applications.
The specific data is subject to PDF, and the above content is for reference