| Allicdata Part #: | ATS19682-ND |
| Manufacturer Part#: |
ATS-11G-103-C2-R1 |
| Price: | $ 4.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X9.5MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-103-C2-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.34070 |
| 10 +: | $ 4.22163 |
| 25 +: | $ 3.98740 |
| 50 +: | $ 3.75278 |
| 100 +: | $ 3.51823 |
| 250 +: | $ 3.28369 |
| 500 +: | $ 3.04914 |
| 1000 +: | $ 2.99050 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.67°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-11G-103-C2-R1 is an effective thermal device for a variety of applications. By dissipating greater amounts of heat in the same amount of space as traditional designs, this Thermal - Heat Sink device allows electronics to operate more efficiently and reliably. The ATS-11G-103-C2-R1 can be used in many applications, including in the telecommunications, automotive, and consumer electronics industries.
The ATS-11G-103-C2-R1 incorporates a combination of a heat sink and fan to provide superior cooling. This Heat Sink features a very reliable and efficient all aluminum construction with dual fin design to maximize airflow and efficient heat dissipation. This device also includes thermal interface materials that are specifically designed to match the requirements of various applications..
The thermal design of the ATS-11G-103-C2-R1 allows it to remove more heat than a traditional heat sink. It features a unique fin profile and a very thin base, allowing the ATS-11G-103-C2-R1 to maintain high performance levels throughout its operational life. Additionally, the heat sink is very compact and easy to install.
The ATS-11G-103-C2-R1’s operation can be described in three stages. First, an airflow is created by the fan, drawing heated air away from the component and toward the heat sink. Second, the fins disperse the heat across their surface area, allowing the heat to be dissipated to the surrounding environment. Finally, the fan dissipates the heat as the air passes over the fins.
The ATS-11G-103-C2-R1 is designed with high-density fins and is perfectly suited for tight spaces. The low-noise fan ensures a pleasant user experience. The thermal design of the ATS-11G-103-C2-R1 provides superior cooling performance, with increased airflow and heat dissipation in confined areas.
The ATS-11G-103-C2-R1 is a highly effective and reliable Thermal - Heat Sink capable of cooling components in a variety of applications. Its advanced thermal design ensures superior heat removal capabilities, making it the perfect solution for a wide range of electronics applications. The low-noise fan operation ensures that the user experience is not affected by excessive noise, and the low-profile design allows the ATS-11G-103-C2-R1 to be installed in even the tightest spaces. All of these features combine to make the ATS-11G-103-C2-R1 the ideal thermal solution for your next electronics project.
The specific data is subject to PDF, and the above content is for reference