ATS-11G-103-C3-R1 Allicdata Electronics
Allicdata Part #:

ATS-11G-103-C3-R1-ND

Manufacturer Part#:

ATS-11G-103-C3-R1

Price: $ 4.60
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X9.5MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11G-103-C3-R1 datasheetATS-11G-103-C3-R1 Datasheet/PDF
Quantity: 1000
10 +: $ 4.14099
30 +: $ 3.91083
50 +: $ 3.68084
100 +: $ 3.45076
250 +: $ 3.22071
500 +: $ 2.99066
1000 +: $ 2.93315
Stock 1000Can Ship Immediately
$ 4.6
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.374" (9.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 27.78°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a critical factor in the operation of electronic devices. The ATS-11G-103-C3-R1 is a thermal heat sink designed for a variety of applications. It is typically used in high power applications where heat dissipating requirements are great, including in LED lighting, AC line filters, inverter circuits, and frequency converters.

The ATS-11G-103-C3-R1 employs both a heat-sink and a fan for improved thermal management. The heat-sink is made of aluminum, which is highly conductive and has an efficient heat dissipation coefficient across a wide range of temperatures. The fan is designed to maximize air-flow over the heat-sink in order to reduce the risk of hot-spots and shorten the warming-up time of the circuit.

The working principle of the ATS-11G-103-C3-R1 is based on the concept of heat convection. Heat energy from the source, usually a semiconductor device, is transferred through the heat-sink material to the air surrounding the heat-sink. The fan then facilitates the flow of air over the heat-sink, creating a convective current that carries heat away from the source through the heat-sink and out into the surrounding environment.

In order to ensure optimal thermal management, the ATS-11G-103-C3-R1 also includes a thermostatic cutoff switch. This switch is embedded in the heat-sink and is designed to automatically shut down the fan in the event that critical thermal thresholds are exceeded. This ensures that components are not exposed to excess heat, which can result in damage or malfunction.

The ATS-11G-103-C3-R1 is designed to be easy to install and use, and is equipped with a wide range of mounting brackets and fixtures to suit a variety of applications. It can also be customized for specific designs or applications. As such, it is widely used in a range of electronics applications, and is especially popular in high-power applications requiring accurate and reliable thermal management.

The specific data is subject to PDF, and the above content is for reference

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