| Allicdata Part #: | ATS-11G-12-C1-R0-ND |
| Manufacturer Part#: |
ATS-11G-12-C1-R0 |
| Price: | $ 3.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-11G-12-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16197 |
| 30 +: | $ 3.07671 |
| 50 +: | $ 2.90581 |
| 100 +: | $ 2.73489 |
| 250 +: | $ 2.56397 |
| 500 +: | $ 2.47851 |
| 1000 +: | $ 2.22211 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-11G-12-C1-R0 is a type of thermal heat sink that is specially designed to control the amount of heat generated by electric devices. It is an advanced system that provides efficient cooling and heat dissipation, making it ideal for all types of applications. This article will explain the application field and working principle of ATS-11G-12-C1-R0 thermal heat sink.
The ATS-11G-12-C1-R0 thermal heat sink is used to dissipate heat generated by electrical devices, including but not limited to, computers, appliances, and industrial equipment. This thermal heat sink utilizes a special aluminum alloy with a heat sink base that has a large surface area to dissipate heat quickly and efficiently. The aluminum alloy used in the production of this thermal heat sink has a high thermal conductivity, allowing the heat to be quickly dispersed throughout a given area.
The working principle of ATS-11G-12-C1-R0 thermal heat sink is based on the characteristic of heat dissipation. Heat naturally dissipates outwardly, away from the heat source, in the form of convection. This heat sink helps to speed up the outward flow of heat by using fins (resembling thin metal plates) to move the heated air away from the source. The aluminum fins, when set up in an enclosure, create a direct flow of heat away from the device, while also increasing the surface area of contact with the air, which in turn aids in further heat dissipation.
Heat dissipating fins have become increasingly popular in recent years because of their easy installation and simple design. The aluminum fins provide a large surface area which is unsurpassed by any other type of material. The design also ensures that no warm spots or hot pockets will form around the source, as the heat is drawn evenly across the fins.
ATS-11G-12-C1-R0 is designed with an anodized finish, making it highly durable and resistant. The finish also helps protect the aluminum from corrosion or wear, making it last longer. This type of thermodynamics heat sink is ideal for applications that require optimal cooling, such as computer systems, consumer electronics, and industrial equipment. The large surface area and the anodized finish make ATS-11G-12-C1-R0 an excellent choice for a variety of applications.
In conclusion, ATS-11G-12-C1-R0 is an advanced thermal heat sink designed to provide efficient cooling and heat dissipation. The aluminum fins are easy to install and the anodized finish provides durability and corrosion resistance. This makes it an ideal choice for applications which require optimal cooling, such as computers, consumer electronics, and industrial equipment. Making use of the principle of convection, ATS-11G-12-C1-R0 thermal heat sink can effectively dissipate heat away from the source, providing a more efficient way to keep temperatures under control.
The specific data is subject to PDF, and the above content is for reference
ATS-11G-12-C1-R0 Datasheet/PDF