| Allicdata Part #: | ATS19707-ND |
| Manufacturer Part#: |
ATS-11G-126-C2-R0 |
| Price: | $ 4.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-126-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.99420 |
| 10 +: | $ 3.88647 |
| 25 +: | $ 3.67063 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.47°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are designed to dissipate heat from electrical components or devices. The ATS-11G-126-C2-R0 is a thermal interface material that efficiently dissipates heat away, making it ideal for thermal management solutions. This product is made from a flame retardant silicone-based material, which is capable of providing excellent conductivity. It is also designed to endure high temperatures, and has a low thermal impedance, making it an excellent choice for applications where thermal performance is critical.
The ATS-11G-126-C2-R0 is mainly used in industrial, automotive and consumer electronic applications. It is ideal for power electronics, including LED drivers, AC-DC converters, switching power supplies and DC-DC converters. It is also suitable for use in devices that require thermal management, such as amplifiers, motors, batteries, power modules and other components that generate a lot of heat. In addition, the ATS-11G-126-C2-R0 is suitable for use in devices with a narrow operating temperature range, such as computers, displays and cameras.
The ATS-11G-126-C2-R0 product is designed to facilitate easy installation. It comes with a self-adhesive backing, so it can be quickly and easily applied to the component or device surface. It can also be combined with a thermal pad, adhesive tape or thermal paste in order to further improve thermal management performance.
The working principle of the ATS-11G-126-C2-R0 is based on a heat conduction and radiation technology. This material consists of a dielectric substrate and a conductive foil which is covered with a durable non-conductive coating. The dielectric substrate acts as a thermal interface, providing a path for heat to be transferred away from the component or device. The conductive foil absorbs the heat from the component and transfers it to the non-conductive coating, which then dissipates the heat away from the component.
The ATS-11G-126-C2-R0 is highly efficient at dissipating heat away from the component and keeping it cool. It has outstanding thermal properties, making it ideal for a variety of applications. It is suitable for use in various environments, including high vibration, shock, and moisture. The product is both UL and RoHS certified, ensuring it meets safety standards. It is also resistant to flame, making it a safe and reliable product for electronics applications.
The ATS-11G-126-C2-R0 is an excellent choice for thermal management solutions in industrial, automotive and consumer electronic applications. It effectively transfers heat away from the component or device, making it an ideal solution for devices that generate a lot of heat. The product is also easy to install and certified to meet safety standards.
The specific data is subject to PDF, and the above content is for reference