| Allicdata Part #: | ATS19710-ND |
| Manufacturer Part#: |
ATS-11G-129-C2-R0 |
| Price: | $ 5.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-129-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.76910 |
| 10 +: | $ 4.63806 |
| 25 +: | $ 4.38052 |
| 50 +: | $ 4.12297 |
| 100 +: | $ 3.86524 |
| 250 +: | $ 3.60755 |
| 500 +: | $ 3.34987 |
| 1000 +: | $ 3.28546 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.65°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used to help maintain temperature balance in machines, functioning by dissipating heat away from components such as processors. ATS-11G-129-C2-R0 is a specific type of heat sink that is used in applications such as fan controllers, instrumentation or any device that needs temperature stabilization.
This device has many features that make it an excellent choice in its application field. It is made of an aluminum alloy and has high metal density, which allows for effective heat dissipation. The device is also designed with a large surface area that allows for maximum heat transfer. The ATS-11G-129-C2-R0 has excellent thermal conductivity and insulation capabilities. These features make it a suitable choice for many applications that require rapid and efficient heat dissipation.
The ATS-11G-129-C2-R0 also has a unique design that allows it to function in both static and dynamic application scenarios. Its design features an air manifold and an open frame design. This design gives the device excellent scalability and effectively reduces the thermal resistance and provides enhanced performance. In addition, it is compact with a highly efficient design.
The ATS-11G-129-C2-R0 also provides excellent design flexibility that allows it to be applied to many different application scenarios. It can be easily connected with different power and thermal elements and is highly compatible with many different components and systems. The device is highly reliable and is designed to withstand high temperatures. It is also designed with specialized fan mounts and other components to maximize its cooling capability.
The ATS-11G-129-C2-R0 operates by transferring heat from the processor or other components to the aluminum alloy fins, which dissipate the heat away from the device. The fins are designed with a large surface area and feature a unique hole structure that is designed to maximize air flow and thermal performance. This allows for superior heat transfer and helps to maintain temperature balance.
It also features a unique air ventilation system that helps to keep the device cool. The ATS-11G-129-C2-R0 utilizes an active cooling system that utilizes fans and other components to dissipate heat away from the device and keep its operating temperature at optimal levels. The device also provides optional components such as cooling fins and fan filters to further optimize cooling.
The ATS-11G-129-C2-R0 is a highly reliable and efficient thermal device that is well suited for use in a variety of different applications. Its features include an excellent design, high metal density, and excellent scalability as well as superior thermal conductivity and insulation. Its unique design allows it to be applied in both static and dynamic applications, and its cooling system helps to maximize the device’s efficiency and performance.
The specific data is subject to PDF, and the above content is for reference