| Allicdata Part #: | ATS-11G-138-C3-R0-ND |
| Manufacturer Part#: |
ATS-11G-138-C3-R0 |
| Price: | $ 3.27 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-138-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.97234 |
| 30 +: | $ 2.89170 |
| 50 +: | $ 2.73105 |
| 100 +: | $ 2.57040 |
| 250 +: | $ 2.40975 |
| 500 +: | $ 2.32942 |
| 1000 +: | $ 2.08845 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks play an important role in controlling the temperature of electronic circuits and components. The ATS-11G-138-C3-R0 is a type of heat sink that is designed to transfer excess heat away from sensitive electronic components in order to protect them from damage or failure. This heat sink is designed with an aluminum finned base that allows heat dissipation from the component to be quickly and effectively dissipated hence preventing overheating and maintaining prolonged operation.
This heat sink is usually used in 2-phase and 3-phase industrial applications. In a 2-phase system, the heat sink provides thermal protection and cooling so that load currents can be distributed to multiple phases in order to balance them and prevent overcurrents; in a 3-phase system, the heat sink provides thermal protection for the integrated circuits and modules used in switching power supplies. In addition, it is also used in protection systems such as airbags, circuit breakers, fuses etc.
The ATS-11G-138-C3-R0 consists of a finned base plate that is attached to the bottom of the sink and a lid that is typically made of aluminium. The finned base plate is designed to transfer heat away from the electronic component or system. The sink has an airflow passage between the base plate and the lid which allows the air to move horizontally and vertically across the components and dissipate heat more efficiently. The air passage can be adjusted to provide more cooling to certain areas if needed.
The working principle of this heat sink is very simple. The heat generated by the electronic components is transferred to the finned base where it is then dissipated by the airflow passage. The air passing through the fins is pushed up and cools the component from the bottom side, then is redirected across the top of the sink, cooling the component from the top side. This process of passing air over and under the component is continued until the component is cooled to an acceptable temperature. The fins provide an increased surface area which aids in dissipating the heat more quickly and efficiently. The larger the fin surface area, the more heat is dissipated.
The ATS-11G-138-C3-R0 is an ideal solution for a variety of applications where electrical components need to be kept cool in order to protect them from damage or failure. It is designed to be simple to install and is suitable for both commercial and industrial applications. The heat sink has proven to be an invaluable tool for a wide range of application fields from automotive and aerospace electronics to telecoms, medical technology and gaming consoles.
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