| Allicdata Part #: | ATS-11G-140-C3-R0-ND |
| Manufacturer Part#: |
ATS-11G-140-C3-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-140-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks solutions are becoming an integral part of modern electronic devices, from phones and tablets to datacenters and automobiles. ATS-11G-140-C3-R0 is a particular heat sink that is designed to offer a wide range of thermal management solutions.
The ATS-11G-140-C3-R0 design is based on a number of thermal properties, including the fin shape, the material fin, baseplate, and the overall size. The fins are designed to optimize surface area and thermal dissipation, while the baseplate is designed to keep the heat conduction at atop level. The overall size of the heat sink is designed to fit the maximum area available on a given printed circuit board, while providing the best thermal and electrical performance.
The ATS-11G-140-C3-R0 is ideal for a variety of applications, including heat sink for DC-DC converters, Infineon’s CoolMOS, IGBTs, MOSFETs, and digital processors. This heat sink has also been used in applications where thermal shielding and protection are paramount, such as when dealing with the extreme temperature conditions of the aerospace and military fields.
The primary application for the ATS-11G-140-C3-R0 is to dissipate heat away from active devices, allowing them to operate within their proper temperature range. The heat sink also acts as a barrier between these active devices and the surrounding components, providing additional protection from thermal damage and the risk of thermal runaway. This barrier also helps to reduce electromagnetic interference, ensuring that the components are operating within their specified tolerances.
The working principle of the ATS-11G-140-C3-R0 heat sink utilizes multiple factors to ensure proper thermal management. The fin shape and material act as a conductor, transferring heat between the base plate and the fins. The size of the heat sink allows for maximum surface area contact between the baseplate and the fins, ensuring that the thermal energy is transferred quickly and efficiently. Additionally, the baseplate is designed to draw in the minimum amount of air needed to maintain the optimal thermal environment.
To ensure proper installation and air flow for the ATS-11G-140-C3-R0 heat sink, a shroud or fan may be used to direct the air as needed. For installations in which a shroud or fan are not necessary, an air gap pad may be applied to the base to increase the overall thermal performance. For higher power applications, additionally, the installation of a thermal compound may be required for an optimized heat transfer from the baseplate to the fins.
The ATS-11G-140-C3-R0 heat sink is an excellent choice for a variety of thermal management applications. It is designed to fit the maximum available area on a given PCB, while providing the optimal thermal and electrical performance. Additionally, it is ideal for use in both low and high power applications, allowing it to be used in a wide variety of scenarios. From military and aerospace use to consumer electronics, the ATS-11G-140-C3-R0 heat sink is an ideal choice for any thermal management solution.
The specific data is subject to PDF, and the above content is for reference