| Allicdata Part #: | ATS-11G-141-C1-R0-ND |
| Manufacturer Part#: |
ATS-11G-141-C1-R0 |
| Price: | $ 3.27 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-141-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.97234 |
| 30 +: | $ 2.89170 |
| 50 +: | $ 2.73105 |
| 100 +: | $ 2.57040 |
| 250 +: | $ 2.40975 |
| 500 +: | $ 2.32942 |
| 1000 +: | $ 2.08845 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.66°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-11G-141-C1-R0 is a kind of thermal heat sink. It is a module with a specific purpose: to help cool down a product or device. It works by dissipating the heat generated by the product or device into the background environment. The heat sink uses the natural laws of thermodynamics to accomplish its purpose.The ATS-11G-141-C1-R0 thermal heat sink is typically composed of a metal plate or sheet, which has a number of small contact points. The plate or sheet is then attached to the product or device using a variety of methods, such as clips, nails, or screws. This contact point moves the heat from the product or device to the thermal heat sink. The heat is then absorbed into the metal plate or sheet, which allows it to spread the heat out evenly into the background environment.The performance of the ATS-11G-141-C1-R0 heat sink depends on the heatsink\'s design, the material used, and the coolant provided. The material used must be able to absorb and spread the heat evenly, and the coolant provided must be able to dissipate the heat through the surroundings.ATS-11G-141-C1-R0 heat sinks have been designed to provide sufficient cooling for high-performance products and devices. It can be used in a variety of applications, including computers, industrial equipment, medical equipment, and consumer electronics. The ATS-11G-141-C1-R0 heat sink is designed to provide reliable cooling performance and longevity. The thermal spreader is designed to dissipate the heat evenly into the background environment, and the combination of the two helps to keep the product or device at a cooler temperature.The design of the ATS-11G-141-C1-R0 heat sink is also optimized for easy installation. It is made with a flexible design that makes it easy to attach to the product or device. Additionally, it does not require any special tools or skills to install the thermal heat sink.The use of ATS-11G-141-C1-R0 heat sinks is becoming more popular in recent years, as the demand for cooled products and devices increases. These heat sinks are especially effective in applications where reliable cooling performance is required.In conclusion, the ATS-11G-141-C1-R0 heat sink is a reliable and efficient thermal module for cooling down products and devices. It is designed to provide reliable cooling performance, longevity, and easy installation. This makes the ATS-11G-141-C1-R0 thermal heat sink a great choice for a variety of applications.
The specific data is subject to PDF, and the above content is for reference