ATS-11G-143-C1-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are an essential part of many electronics systems. The ATS-11G-143-C1-R0 is a thermal heat sink that is designed to ensure optimal use of its components when cooling electronic components down in temperature sensitive environments.

The ATS-11G-143-C1-R0 is commonly used in areas such as telecommunications, defense, aerospace and industrial control applications. The device is used to ensure the placement, stability, and insulation of components within a system. This device is also used to provide appropriate thermal insulation for active and passive components within an individual device or system. The device is also used to ensure reliable operation of active and passive components in temperature sensitive environments.

The device is designed to direct and equalize heat produced by these components throughout the thermal system, providing an even temperature distribution while simultaneously increasing dissipation of heat from the component. The device is also intended to lessen stress induced by thermal cycles. The ATS-11G-143-C1-R0 uses a patented combination of fins, air-flow channels, and plate materials to reduce weight, improve air flow, and achieve thermal stability.

The ATS-11G-143-C1-R0 is made of metal sheet with high thermal conductivity and an optimized internal geometry providing a low thermal resistance. The device also features an anodized finish and alloy frame, which helps in preventing corrosion, providing added protection against electromagnetic and radio frequency interference (EMI/RFI). The device is also designed to minimize thermal gradient across its different components.

When installing the ATS-11G-143-C1-R0, particular attention must be paid to its mounting orientation and position. If installed wrongly, it will not provide optimal performance, and may even cause damage to the system. The device includes screws and clips for mounting, and these must all be tight before activating the device. All mounting positions must be within the specified requirements, as stated in the product\'s datasheet.

In general, the ATS-11G-143-C1-R0 typically offers a thermal resistance between 0.2°C/W and 0.3°C/W depending on the clip positions and the installation environment. The device\'s thermal resistance is also determined by the size of the fin, the fin spacing and the number of fins. The device also features high durability, due to its structural elements, anodized surface, and stress-resistant alloy frame. The device also has a high level of stability and is not affected by temperature variances.

Overall, the ATS-11G-143-C1-R0 is a highly efficient thermal heat sink that is used in a wide variety of applications. It has an anodized finish and a robust frame that is designed to provide reliable operation in temperature sensitive environments. It also features optimized internal geometry, lightweight and highly effective materials which make it a great choice for performance-critical applications.

The specific data is subject to PDF, and the above content is for reference