| Allicdata Part #: | ATS-11G-15-C3-R0-ND |
| Manufacturer Part#: |
ATS-11G-15-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-15-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are a type of heat transfer mechanism used to reduce the temperature of an electronic component or system and its surrounding environment. The heat sink works by transferring heat away from the component, spreading it across a wide surface area. In recent years, the development of advanced thermal management technologies has enabled the use of thermal heat sinks to become an integral part of any type of electronic device or system. One of such thermal management technologies is the ATS-11G-15-C3-R0, which is a heat sink designed and engineered by Advanced Thermal Solutions, Inc.
The ATS-11G-15-C3-R0 is a high performance heat sink specifically engineered to provide effective heat dissipation for a variety of applications. The heat sink is made up of three components: the base plate, fins, and the top plate. The base plate is made from high quality aluminum and provides a base of support for the other components of the heat sink. The fins are designed to increase the surface area of the heat sink to make the most efficient use of the air flow, and to allow more heat to be dissipated from the component or system. The top plate is made from copper and acts as an additional layer of thermal protection on the heat sink. It also serves as the interface between the base plate, fins, and the component being cooled.
The ATS-11G-15-C3-R0 is capable of dissipating up to 95 W from an aluminum fin design, making it a perfect choice for many applications that require high performance heat management. It is also designed for use in extreme temperature environments, and is equipped with high quality fasteners for easy installation in various types of housings. This makes it an ideal choice for any application that requires efficient thermal management.
The ATS-11G-15-C3-R0 is designed to provide reliable thermal protection for a wide range of applications, including industrial servers, supercomputers, data centers, gaming systems, and embedded solutions. It is also well suited for applications that require high power density, such as LED lighting, laser diodes, and power converters. In addition, the heat sink can be used in many environments, including those in which high temperatures and vibration levels are present.
The ATS-11G-15-C3-R0 is a high performance heat sink designed to offer efficient and reliable thermal management solutions in a wide variety of applications. It is a perfect choice for applications that require fast heat dissipation, as well as effective cooling in extreme temperature environments. Furthermore, it is designed with high performance fasteners and a base plate that provides a robust interface for secure mounting and efficient thermal transfer. As such, this makes the ATS-11G-15-C3-R0 the ideal heat sink for various thermal management applications.
The specific data is subject to PDF, and the above content is for reference