| Allicdata Part #: | ATS19745-ND |
| Manufacturer Part#: |
ATS-11G-160-C2-R0 |
| Price: | $ 4.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-160-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.18320 |
| 10 +: | $ 4.07169 |
| 25 +: | $ 3.84527 |
| 50 +: | $ 3.61910 |
| 100 +: | $ 3.39293 |
| 250 +: | $ 3.16673 |
| 500 +: | $ 2.94054 |
| 1000 +: | $ 2.88399 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.67°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-11G-160-C2-R0 is a highly efficient thermal-heat sink from AVX Corporation, capable of providing efficient and reliable cooling for a variety of applications. This device is designed to be used in areas where temperature control is of prime importance, such as in power electronics, communications and data storage equipment, avionics, industrial and medical equipment, and electro-mechanical advancement.
As a thermal-heat sink, ATS-11G-160-C2-R0 is designed to provide efficient and reliable cooling for a variety of applications. It is constructed with a high quality aluminum base and a finned copper heat sink with a thermally conductive surface. This surface conducts heat away from the components within an enclosure, preventing component performance-limiting temperatures and reducing long-term power losses. This thermal-heat sink is also designed to absorb and dissipate heat energy from the environment, keeping components and systems running at their peak performance.
The ATS-11G-160-C2-R0 thermal-heat sink is designed to provide reliable cooling in a variety of applications. It can be used in power electronics, communications and data storage equipment, avionics, industrial and medical equipment, and electro-mechanical advancement. Its thermal-conductive surface allows for efficient heat dissipation from components and helps prevent component malfunction from high temperatures. It is also capable of absorbing and dissipating large amounts of heat energy from the environment, enabling components and systems to run at their peak performance.
The working principle of thermal-heat sink systems like the ATS-11G-160-C2-R0 is based on the conversion of heat energy from the component or system to thermal energy. This is done using a specifically designed heat sink and a thermally conductive surface. This surface absorbs and dissipates heat build-up inside the enclosure, allowing components to maintain their functionality and performance. The heat sink also helps to dissipate the thermal energy from the environment, reducing power losses and improving system performance.
The ATS-11G-160-C2-R0 thermal-heat sink provides excellent performance when used in a variety of applications. It is designed to provide efficient and reliable cooling for a variety of components, systems and enclosures and helps to protect components from high temperatures. It is capable of absorbing and dissipating heat energy from the environment, allowing components and systems to run at their peak efficiency. It is also designed to reduce power loss and improve system performance, making it an ideal solution for a variety of applications.
The specific data is subject to PDF, and the above content is for reference