ATS-11G-168-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.94°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction to Thermal-Heat Sinks

In the modern technological world, thermal-heat sinks are becoming increasingly commonplace. These devices are used to dissipate heat produced by electronics and components, providing a safe, efficient way to help keep them running without overheating. This article will explore the application field and working principle of one such device, the ATS-11G-168-C1-R0.

Application Field of ATS-11G-168-C1-R0

The ATS-11G-168-C1-R0 is a thermal-heat sink designed for high-powered electronics and components. It is designed to cope with temperatures up to 300°C, and is suitable for applications that require a large amount of power with good heatsinking capabilities.The ATS-11G-168-C1-R0 is a high-performance heat sink, designed to perform under the harshest conditions. It is commonly used in industrial applications, such as in strict production and manufacturing environments, or in applications where temperatures and power needs can vary quite drastically.

Working Principle of ATS-11G-168-C1-R0

The ATS-11G-168-C1-R0 works by dissipating heat generated from electronics and components. It does this by using a series of metal fins to conduct heat away from the device, and then to draw it away from the surrounding environment.The fins of the device are arranged in an open pattern, allowing air to pass through them as the device cools down. As air is drawn in, it is cooled by the metal fins, taking some of the heat away from the device. The air is eventually released as the fins continue to dissipate the heat, thus cooling the device in the process.The ATS-11G-168-C1-R0 is designed to maximize the cooling efficiency of the device it is attached to. Its metal fins are spaced to create an area where there is less air resistance, allowing more air to pass through and cool the device.In addition to its passive cooling capabilities, the ATS-11G-168-C1-R0 also has active cooling capabilities. This is usually achieved by placing the thermal-heat sink directly over an active cooling fan, or by mounting the thermal-heat sink onto an active cooling enclosure. This helps to further reduce the temperature of the device being cooled.

Conclusion

The ATS-11G-168-C1-R0 is a thermal-heat sink designed for high-powered electronics and components. It is designed to cope with temperatures of up to 300°C, and is suitable for applications that require a large amount of power with good heatsinking capabilities. The device works by using a series of metal fins to conduct heat away from the device, and then to draw it away from the surrounding environment. It also has active cooling capabilities, allowing for better thermal management of the device being cooled.

The specific data is subject to PDF, and the above content is for reference