| Allicdata Part #: | ATS-11G-17-C3-R0-ND |
| Manufacturer Part#: |
ATS-11G-17-C3-R0 |
| Price: | $ 4.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-17-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.80520 |
| 30 +: | $ 3.59415 |
| 50 +: | $ 3.38260 |
| 100 +: | $ 3.17123 |
| 250 +: | $ 2.95982 |
| 500 +: | $ 2.74840 |
| 1000 +: | $ 2.69555 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are a type of cooling device that increase the surface area of a given object in order to dissipate heat more effectively. They are commonly used in various electrical devices and can be made from a variety of materials, ranging from plastic to metals like aluminum and copper. Their design depends greatly on the type of device they are being used in, as well as their environment. One such heat sink is the ATS-11G-17-C3-R0 heat sink, which is primarily used in applications involving high powered semiconductors.
ATS-11G-17-C3-R0 Application Field
The ATS-11G-17-C3-R0 heat sink is designed for use in applications that involve high powered semiconductors. This includes power electronics, power supplies, and power amplifiers. It is also widely used in industrial and commercial applications such as automotive electronics, telecommunication, computer, consumer electronics, and green energy systems. The heat sink’s high thermal performance enables it to handle extreme temperatures, making it suitable for use in a variety of high powered applications.
ATS-11G-17-C3-R0 Working Principle
The ATS-11G-17-C3-R0 heat sink works by increasing the surface area of the object it is attached to. This increased surface area provides greater paths for heat to be dissipated away from the object. The heat sink is designed to be as efficient as possible by using materials that have high thermal conductivity ratings. This ensures that the heat is quickly and effectively dissipated away from the object.
The heat sink also works in conjunction with other cooling devices, such as fans, to further improve heat dissipation. The use of a fan in combination with the heat sink can increase the airflow around the object, which increases the rate of cooling. This is especially important if the object is located in an environment with high ambient temperatures.
The ATS-11G-17-C3-R0 heat sink is also designed to be durable and reliable. It is built to be resistant to corrosion and wear, and is also designed to be vibration and shock resistant. This ensures that it will perform reliably in even the most demanding applications.
Conclusion
The ATS-11G-17-C3-R0 heat sink is designed for use in applications involving high powered semiconductors. It works by increasing the surface area of the object it is attached to, which increases the paths for heat to be dissipated away from the object. The heat sink is also designed to work in conjunction with other cooling devices, such as fans, to further improve heat dissipation. It is also designed to be durable and reliable, and can withstand extreme temperatures and tough environments. For these reasons, the ATS-11G-17-C3-R0 heat sink is ideal for a variety of high powered, demanding applications.
The specific data is subject to PDF, and the above content is for reference