| Allicdata Part #: | ATS-11G-170-C3-R0-ND |
| Manufacturer Part#: |
ATS-11G-170-C3-R0 |
| Price: | $ 3.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-170-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.32892 |
| 30 +: | $ 3.23862 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor in system longevity and performance. Modern electronic components generate heat due to their increased processing power and associated energy consumption. This heat can cause harmful thermal stress, reduce device life, and limit performance.
Heat sinks are essential components in order to prevent these hazardous effects from occurring on sensitive electronic components by dissipating heat away from the device. ATS-11G-170-C3-R0 is a robust heat sink that is specifically designed to dissipate large amounts of heat generated by high powered components. This particular model provides 171 W of thermal dissipation per channel, making it one of the most efficient thermal solutions available.
The ATS-11G-170-C3-R0 features a robust design with a die-cast aluminum alloy base and corrosion-resistant copper-finned fins. This combination of superior material quality and design assures the maximum heat transfer efficiency available. Its configurable thermal system can be used to mount a variety of sizes and types of cooling devices. It can be easily mounted in either vertical or horizontal orientation, providing flexibility for the thermal system design according to the application\'s needs.
To ensure a maximum heat dissipation capacity, this model is equipped with an additional fan that is placed over the fins and rotates at a full speed. This fan enhances the thermal capacity of ATS-11G-170-C3-R0 above its rated maximum thermal dissipation capacity. It also features optional side panel fans and adjustable air filters that can further enhance the thermal system performance for larger thermal loads.
The ATS-11G-170-C3-R0 is also designed to protect the components from humidity and dust. Its ergonomic design includes air vents that allow efficient air circulation and keep the environment inside the system free from any unwanted particles. The thermal solution is also vibration-resistant, allowing it to work in extreme vibration environments.
ATS-11G-170-C3-R0 is an ideal thermal solution for demanding environments ratings with high thermal loads. Its 171 W-copper-finned aluminum alloy base enables the fast dissipation of heat from the components, while its adjustable air filters and optional side-panel fan provide flexible thermal management. Additionally, its vibration-resistant body and ergonomic design protect components from dust and humidity, providing ultimate reliability and performance.
The specific data is subject to PDF, and the above content is for reference